ADSP-BF531WBBCZ-4A AD [Analog Devices], ADSP-BF531WBBCZ-4A Datasheet - Page 58

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ADSP-BF531WBBCZ-4A

Manufacturer Part Number
ADSP-BF531WBBCZ-4A
Description
Blackfin Embedded Processor
Manufacturer
AD [Analog Devices]
Datasheet
ADSP-BF531/ADSP-BF532
OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
0.08 MAX LEAD
COPLANARITY
1. DIMENSIONS IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 OF ITS
3. CENTER DIMENSIONS ARE NOMINAL
NOTES
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTION.
SEATING
PLANE
MAX
1.70
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
3. MINIMUM BALL HEIGHT 0.25.
0.27
0.22
0.17
0.15
MO-205, VARIATION AE WITH EXCEPTION OF
THE BALL DIAMETER.
0.05
BALL A1
INDICATOR
Figure 60. Chip Scale Package Ball Grid Array (Mini-BGA) BC-160
DETAIL A
12.00 BSC SQ
TOP VIEW
1.60 MAX
DETAIL A
1.45
1.40
1.35
Rev. D | Page 58 of 60 | August 2006
Figure 59. Quad Flatpack (LQFP) ST-176-1
0.75
0.60
0.45
SEATING
PLANE
0.40 NOM
(NOTE 3)
10.40
BSC
1.31
1.21
1.11
SQ
44
DETAIL A
176
1
45
PIN 1
14 12
13
BALL DIAMETER
BOTTOM VIEW
11
BALL PITCH
10
0.80 BSC
DETAIL A
TOP VIEW (PINS DOWN)
9
0.50
0.45
0.40
8
7
26.00
24.00 BSC SQ
6
5
4
BSC SQ
3
2
LEAD PITCH
COPLANARITY
1
0.50 BSC
A1 CORNER
INDEX AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
MAX
0.12
133
88
89
132

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