ADSP-BF531WBBCZ-4A AD [Analog Devices], ADSP-BF531WBBCZ-4A Datasheet - Page 60

• Manufacturer Part Number: ADSP-BF531WBBCZ-4A
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-BF531/ADSP-BF532
ORDERING GUIDE
1
2
3
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Model
ADSP-BF532SBBC400
ADSP-BF532SBBCZ400
ADSP-BF532WBBCZ-4A
ADSP-BF532WYBCZ-4A
ADSP-BF532SBST400
ADSP-BF532SBSTZ400
ADSP-BF532WBSTZ-4A
ADSP-BF532SBB400
ADSP-BF532SBBZ400
ADSP-BF532WBBZ-4A
ADSP-BF532WYBZ-4A
ADSP-BF531SBBC400
ADSP-BF531SBBCZ400
ADSP-BF531WBBCZ-4A
ADSP-BF531SBST400
ADSP-BF531SBSTZ400
ADSP-BF531WBSTZ-4A
ADSP-BF531SBB400
ADSP-BF531SBBZ400
ADSP-BF531WBBZ-4A
ADSP-BF531WYBZ-4A
Referenced temperature is ambient temperature.
Z = Pb-free part.
Automotive grade part.
ADSP-BF531WYBCZ-4A
2
2
2, 3
2, 3
2, 3
2, 3
2
2
2
2
2, 3
2, 3
2, 3
2, 3
2, 3
2, 3
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 160-Ball Chip Scale Package
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 169-Ball Plastic Ball Grid Array (PBGA) B-169
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 160-Ball Chip Scale Package
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C 169-Ball Plastic Ball Grid Array (PBGA) B-169
1
D03728-0-8/06(D)
Package Description
Ball Grid Array (Mini-BGA)
160-Ball Chip Scale Package
Ball Grid Array (Mini-BGA)
160-Ball Chip Scale Package
Ball Grid Array (Mini-BGA)
Ball Grid Array (Mini-BGA)
176-Lead Quad Flatpack (LQFP)
176-Lead Quad Flatpack (LQFP)
176-Lead Quad Flatpack (LQFP)
169-Ball Plastic Ball Grid Array (PBGA) B-169
169-Ball Plastic Ball Grid Array (PBGA) B-169
169-Ball Plastic Ball Grid Array (PBGA) B-169
160-Ball Chip Scale Package
Ball Grid Array (Mini-BGA)
160-Ball Chip Scale Package
Ball Grid Array (Mini-BGA)
160-Ball Chip Scale Package
Ball Grid Array (Mini-BGA)
Ball Grid Array (Mini-BGA)
176-Lead Quad Flatpack (LQFP)
176-Lead Quad Flatpack (LQFP)
176-Lead Quad Flatpack (LQFP)
169-Ball Plastic Ball Grid Array (PBGA) B-169
169-Ball Plastic Ball Grid Array (PBGA) B-169
169-Ball Plastic Ball Grid Array (PBGA) B-169
160-Ball Chip Scale Package
Rev. D | Page 60 of 60 | August 2006
Package
Option
BC-160
BC-160
BC-160
BC-160
ST-176-1 400 MHz
ST-176-1 400 MHz
ST-176-1 400 MHz
BC-160
BC-160
BC-160
BC-160
ST-176-1 400 MHz
ST-176-1 400 MHz
ST-176-1 400 MHz
Instruction
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
400 MHz
Rate (Max)
Operating Voltage
(Nom)
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
1.2 V internal,
1.8 V, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O
1.2 V internal, 3.0 V or 3.3 V I/O