AD14160KB-4 AD [Analog Devices], AD14160KB-4 Datasheet - Page 42

• Manufacturer Part Number: AD14160KB-4
• Description: Quad-SHARC DSP Multiprocessor Family
• Manufacturer: AD [Analog Devices]

AD14160/AD14160L
Thermal Characteristics
The AD14160/AD14160L is packaged in a 452-lead ceramic
ball grid array (CBGA). The package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. The AD14160/AD14160L is specified for a
case temperature (T
attachment material should be such that T
Thermal Cross-Section
The data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. The top
layer of the package, where the die are mounted, is a metal V
layer. The approximate metal area coverage from the metal
planes and routing layers is estimated below.
DBGA PADS
Material
Ceramic
Kovar
Tungsten
Thermoplastic
Silicon
THICKNESS 5 MILS
THERMOPLASTIC
BASE
SIG2
SIG3
GND
SIG4
SIG5
V
DD
CASE
Thermal Conductivity
). Design of the mounting surface and
SILICON DIE
JC
19 MILS
= 0.36 C/W
Thermal Conductivity
W/cm C
0.18
0.14
1.78
0.03
1.45
CASE
SIGI
is not exceeded.
SUB-PAD
DD
Figure 41.
–42–
KOVAR LID
0.015 IN
Layer
V
SIG2
SIG3
GND
SIG4
SIG5
BASE
(Assume Uniformly Distributed)
DD
Metal Coverage Per Layer
KOVAR SEAL RING
HEIGHT = 50 MILS
SEAL RING METALIZATION
CERAMIC LAYER 28 MILS
(2 LAYERS 14 MILS EACH)
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 8 MILS
Percent Metal
(1 Mil Thick)
87
12
12
89
14
13
91
REV. A