PIC12F1822 MICROCHIP [Microchip Technology], PIC12F1822 Datasheet - Page 9

• Manufacturer Part Number: PIC12F1822
• Description: 8/14-Pin Flash Microcontrollers with nanoWatt XLP Technology
• Manufacturer: MICROCHIP [Microchip Technology]

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 99
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 103
12.0 I/O Ports ................................................................................................................................................................................... 117
13.0 Interrupt-on-Change ................................................................................................................................................................. 127
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 131
15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 133
16.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 147
17.0 SR Latch................................................................................................................................................................................... 153
18.0 Comparator Module.................................................................................................................................................................. 159
19.0 Timer0 Module ......................................................................................................................................................................... 169
20.0 Timer1 Module ......................................................................................................................................................................... 172
21.0 Timer2 Modules........................................................................................................................................................................ 184
22.0 Data Signal Modulator (DSM) .................................................................................................................................................. 189
23.0 Capture/Compare/PWM Module .............................................................................................................................................. 199
24.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 225
25.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 279
26.0 Capacitive Sensing Module...................................................................................................................................................... 307
27.0 In-Circuit Serial Programming
28.0 Instruction Set Summary .......................................................................................................................................................... 319
29.0 Electrical Specifications............................................................................................................................................................ 333
30.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 365
31.0 Development Support............................................................................................................................................................... 367
32.0 Packaging Information.............................................................................................................................................................. 371
Appendix A: Revision History............................................................................................................................................................. 387
Appendix B: Device Differences ........................................................................................................................................................ 387
Index .................................................................................................................................................................................................. 389
The Microchip Web Site ..................................................................................................................................................................... 395
Customer Change Notification Service .............................................................................................................................................. 395
Customer Support .............................................................................................................................................................................. 395
Reader Response .............................................................................................................................................................................. 396
Product Identification System ............................................................................................................................................................ 397
 2010 Microchip Technology Inc.
Device Overview ........................................................................................................................................................................ 11
Enhanced Mid-range CPU ......................................................................................................................................................... 19
Memory Organization ................................................................................................................................................................. 21
Device Configuration .................................................................................................................................................................. 49
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 55
Reference Clock Module ............................................................................................................................................................ 71
Resets ........................................................................................................................................................................................ 75
Interrupts .................................................................................................................................................................................... 83
Power-Down Mode (Sleep) ........................................................................................................................................................ 95
™
(ICSP
™
) ................................................................................................................................ 315
PIC12F/LF1822/16F/LF1823
Preliminary
DS41413A-page 9