NG80960JA-16 INTEL [Intel Corporation], NG80960JA-16 Datasheet - Page 35

• Manufacturer Part Number: NG80960JA-16
• Description: EMBEDDED 32-BIT MICROPROCESSOR
• Manufacturer: INTEL [Intel Corporation]

Table 12.
Table 13.
Advance Information Datasheet
132-Lead PGA Package Thermal Characteristics
196-Ball MPBGA Package Thermal Characteristics
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2.
3.
4.
5.
6.
7.
8.
JC
CA
CA
CA
JC
CA
CA
CA
(Junction-to-Case)
(Case-to-Ambient) (Omnidirectional Heatsink)
(Case-to-Ambient) (Unidirectional Heatsink)
(Junction-to-Case)
(Case-to-Ambient) (Omnidirectional Heatsink)
(Case-to-Ambient) (Unidirectional Heatsink)
(Case-to-Ambient) (No Heatsink)
(Case-to-Ambient) (No Heatsink)
JA
J-CAP
J-PIN
J-PIN
J-CAP
J-PIN
J-PIN
=
= 6.4°C/W (inner pins) (approximate) (no heatsink)
= 6.2°C/W (outer pins) (approximate) (no heatsink)
= 3.3°C/W (inner pins) (approximate) (with heatsink)
= 3.3°C/W (outer pins) (approximate) (with heatsink)
JC
= 5.6°C/W (approximate) (no heatsink)
= 3°C/W (approximate) (with heatsink)
+
CA
Parameter
Parameter
J-PIN
Thermal Resistance — °C/Watt
Thermal Resistance — °C/Watt
TBD
JA
TBD
TBD
TBD
TBD
0.7
(0)
(0)
25
15
16
0
0
80960JA/JF/JD/JT 3.3 V Microprocessor
JC
(1.01)
(1.01)
TBD
TBD
TBD
TBD
200
200
0.7
19
9
8
CA
Airflow — ft./min (m/sec)
Airflow — ft./min (m/sec)
J-CAP
(2.03)
(2.03)
TBD
TBD
TBD
TBD
400
400
0.7
14
6
6
(3.04)
(3.04)
TBD
TBD
TBD
TBD
600
600
0.7
12
5
5
(4.06)
(4.06)
TBD
TBD
TBD
TBD
800
800
0.7
11
4
4
(5.08)
(5.08)
1000
1000
TBD
TBD
TBD
TBD
0.7
10
4
4
35