HYB18T512800B2F QIMONDA [Qimonda AG], HYB18T512800B2F Datasheet - Page 16
![no-image](/images/no-image-200.jpg)
HYB18T512800B2F
Manufacturer Part Number
HYB18T512800B2F
Description
200-Pin SO-DIMM DDR2 SDRAM Modules
Manufacturer
QIMONDA [Qimonda AG]
Datasheet
1.HYB18T512800B2F.pdf
(86 pages)
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1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
2) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS,
3) Inputs are not recognized as valid until
4) The output timing reference voltage level is
5)
1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew
2) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS / DQS, RDQS / RDQS,
3) Inputs are not recognized as valid until
4) The output timing reference voltage level is
5)
Rev. 1.1, 2007-01
08212006-PKYN-2H1B
Speed Grade
QAG Sort Name
CAS-RCD-RP latencies
Parameter
Clock Frequency
Row Active Time
Row Cycle Time
RAS-CAS-Delay
Row Precharge Time
Speed Grade
QAG Sort Name
CAS-RCD-RP latencies
Parameter
Clock Frequency
Row Active Time
Row Cycle Time
RAS-CAS-Delay
Row Precharge Time
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode.
input reference level is the crosspoint when in differential strobe mode.
t
Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode.
input reference level is the crosspoint when in differential strobe mode.
t
RAS.MAX
RAS.MAX
is calculated from the maximum amount of time a DDR2 device can operate without a refresh command which is equal to 9 x
is calculated from the maximum amount of time a DDR2 device can operate without a refresh command which is equal to 9 x
@ CL = 3
@ CL = 4
@ CL = 5
@ CL = 3
@ CL = 4
@ CL = 5
V
V
REF
REF
Symbol
t
t
t
t
t
t
t
V
V
CK
CK
CK
RAS
RC
RCD
RP
stabilizes. During the period before
stabilizes. During the period before
TT
TT
.
.
Symbol
t
t
t
t
t
t
t
CK
CK
CK
RAS
RC
RCD
RP
DDR2–667C
–3
4–4–4
Min.
5
3
3
45
57
12
12
16
Speed Grade Definition Speed Bins for DDR2–533C
Speed Grade Definition Speed Bins for DDR2–667
8
8
8
70000
—
—
—
Max.
DDR2–533C
–3.7
4–4–4
Min.
5
3.75
3.75
45
60
15
15
HYS64T[32/64/128]xxxEDL–[25F/…/3.7](–)B2
V
V
REF
REF
DDR2–667D
–3S
5–5–5
Min.
5
3.75
3
45
60
15
15
stabilizes, CKE = 0.2 x
stabilizes, CKE = 0.2 x
Small Outlined DDR2 SDRAM Modules
Max.
8
8
8
70000
—
—
—
Max.
8
8
8
70000
—
—
—
Unit
t
—
ns
ns
ns
ns
ns
ns
ns
CK
V
V
DDQ
DDQ
Unit
t
—
ns
ns
ns
ns
ns
ns
ns
CK
Internet Data Sheet
is recognized as low.
is recognized as low.
TABLE 13
TABLE 14
Note
1)2)3)4)
1)2)3)4)
1)2)3)4)
1)2)3)4)5)
1)2)3)4)
1)2)3)4)
1)2)3)4)
Note
1)2)3)4)
1)2)3)4)
1)2)3)4)
1)2)3)4)5)
1)2)3)4)
1)2)3)4)
1)2)3)4)
t
t
REFI
REFI
.
.
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