FAN5350_08 FAIRCHILD [Fairchild Semiconductor], FAN5350_08 Datasheet - Page 14

• Manufacturer Part Number: FAN5350_08
• Description: 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging
• Manufacturer: FAIRCHILD [Fairchild Semiconductor]

© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.3
Physical Dimensions
Product Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
F
INDEX AREA
BALL A1
2X
FAN5350UCX
(Y)+/-.018
D
0.05 C
Product
0.03 C
0.433
C
0.50
BOTTOM VIEW
TOP VIEW
1 2
E
F
3
Figure 34. 5-Bump Wafer-Level Chip-Scale Package (WLCSP)
1.370 +/- 0.030
SEATING PLANE
0.50
C
B
A
(X)+/-.018
A
(Continued)
0.625 MAX
D
5 X Ø0.315 +/- .025
0.06 C
B
D
0.005
2X
F
SIDE VIEWS
F
E
0.03 C
C A B
1.000 +/- 0.030
0.332±0.018
E
14
(Ø0.25)
Cu PAD
C. DIMENSIONS AND TOLERANCES PER
E
D
F
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
H. DRAWING FILENAME: MKT-UC005AArev5
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
RECOMMENDED LAND PATTERN (NSMD)
DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
PACKAGE TYPICAL HEIGHT IS 582 MICRONS
FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
SAC405 ALLOY
ASME Y14.5M, 1994
+/- 43 MICRONS (539-625 MICRONS)
(0.433)
A1
0.250±0.025
0.270
X
(0.50)
(0.866)
(Ø0.35)
SOLDER MASK
OPENING
0.272
Y
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