STR910FAZ32H6T STMICROELECTRONICS [STMicroelectronics], STR910FAZ32H6T Datasheet - Page 95

• Manufacturer Part Number: STR910FAZ32H6T
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STR91xFAx32 STR91xFAx42 STR91xFAx44
9.2
Thermal characteristics
The average chip-junction temperature, T
The average chip-junction temperature, T
following equation:
Where:
P
Most of the time for the applications P
P
and/or memories. The worst case P
2.0V).
An approximate relationship between P
Therefore (solving equations 1 and 2):
where:
Table 49.
I/O
I/O
Symbol
represents the Power Dissipation on Input and Output Pins;
may be significant if the device is configured to drive continuously external modules
Θ
Θ
Θ
JA
JA
JA
Thermal characteristics
T
–
–
–
–
P
K = P
–
J
D
Thermal Resistance Junction-Ambient
LQFP 80 - 12 x 12 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP128 - 14 x 14 mm / 0.4 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
= T
= K / (T
T
Θ
P
P
Internal Power.
K is a constant for the particular part, which may be determined from
equation (3) by measuring P
value of K, the values of P
equations (1) and (2) iteratively for any value of T
D
A
A
D
INT
JA
x (T
+ (P
is the Ambient Temperature in °C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
is the product of I
J
A
D
+ 273°C) (2)
+ 273°C) + Θ
x Θ
JA
)(1)
INT
Parameter
INT
I/O
of the STR91xFA is 500mW (I
D
< P
JA
J
and P
and T
J
DD
, in degrees Celsius, may be calculated using the
must never exceed 125° C.
x P
INT
and V
D
D
J
I/O
and may be neglected. On the other hand,
and T
D
2
(if P
(3)
(at equilibrium) for a known T
(P
DD
D
I/O
, expressed in Watts. This is the Chip
J
= P
may be obtained by solving
is neglected) is given by:
INT
+ P
Package mechanical data
I/O
),
A
DD
.
Value
41.5
36.5
x V
38
DD
, or 250mA x
A.
Using this
°C/W
°C/W
°C/W
Unit
95/99