TS83C51RD2 ATMEL [ATMEL Corporation], TS83C51RD2 Datasheet - Page 6

• Manufacturer Part Number: TS83C51RD2
• Description: Qualification Package TS87C51RD2 / TS83C51RD2 CMOS 0.5Um
• Manufacturer: ATMEL [ATMEL Corporation]

Qualpack TS87C51RD2/TS83C51RD2
4 Qualification
4.1 Qualification Flow
General Requirements for Plastic packaged CMOS IC
June 2001
MIL-STD 883D
Method 3015.7
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
JESD22-A101
JESD22-A110
Atmel Nantes
JESD20-STD
Atmel Nantes
Method 1005
Method 1005
Method 1010
Method 2003
Method 2015
PAQA0046
PAQA0184
JEDEC 78
Standard
EIA
EIA
EIA
50mW power injection, 1.5 Vcc over voltage 125°C
1000 hours 140°C / 5.75V Dynamic or Static
Electrical Life Test (Latent Failure Rate)
Electrical Life Test (Early Failure Rate)
Infra Red Stress 235°C/25s/3 times
+/-2000v 1.5kOhm/100pF/3 pulses
Autoclave after Preconditioning
High Temperature Storage 165°C
1000 cycles –65°C/150°C air/air
Resistance to Soldering Heat
Electrostatic Discharge HBM
1000 hours 85°C/85%RH/5.5V
168 hours 130°C/85%RH/5.5V
MEMORY Data Retention
144 hours 130°C/85%RH
12 hours 140°C / 5.75V
Marking Permanency
Temperature Cycling
85/85 Humidity Test
Test Description
Solderability
Latch-up
HAST
Atmel Wireless & Microcontrollers
0/5 per condition
0/10 per level
0/100 - 500h
Qualification
0/3 per level
1/2000 - 12h
acceptance
0/50 - 500h
0/50 - 168h
0/50 - 500c
0/50 - 500h
0/50 - 72h
0/3
0/3