HFI50N06 SEMIHOW [SemiHow Co.,Ltd.], HFI50N06 Datasheet

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HFI50N06

Manufacturer Part Number
HFI50N06
Description
60V N-Channel MOSFET
Manufacturer
SEMIHOW [SemiHow Co.,Ltd.]
Datasheet
* When mounted on the minimum pad size recommended (PCB Mount)
V
I
I
V
E
I
E
dv/dt
P
T
T
R
R
R
D
DM
AR
J
L
HFW50N06 / HFI50N06
60V N-Channel MOSFET
DSS
GS
AS
AR
D
FEATURES
 Originative New Design
 Superior Avalanche Rugged Technology
 Robust Gate Oxide Technology
 Very Low Intrinsic Capacitances
 Excellent Switching Characteristics
 Unrivalled Gate Charge : 40 nC (Typ.)
 Extended Safe Operating Area
 Lower R
 100% Avalanche Tested
θJC
θ JA
θJA
, T
Thermal Resistance Characteristics
Absolute Maximum Ratings
Symbol
Symbol
STG
DS(ON)
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
Power Dissipation (T
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
Junction-to-Case
Junction-to-Ambient*
Junction-to-Ambient
: 0.018 Ω (Typ.) @V
- Derate above 25℃
Parameter
Parameter
A
C
– Continuous (T
– Continuous (T
– Pulsed
= 25℃)*
= 25℃)
GS
=10V
T
C
=25℃ unless otherwise specified
C
C
= 25℃)
= 100℃)
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Typ.
--
--
--
-55 to +175
Value
35.4
±25
3.75
200
490
120
300
7.0
0.8
60
50
50
12
BV
R
I
1.Gate 2. Drain 3. Source
D
HFW50N06
D
DS(on)
2
Max.
-PAK
1.24
62.5
= 50 A
DSS
40
= 18 mΩ
◎ SEMIHOW REV.A0,Mar 2009
= 60 V
I
Nov 2009
HFI50N06
2
-PAK
Units
W/℃
Units
V/ns
℃/W
mJ
mJ
W
W
V
A
A
A
V
A

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HFI50N06 Summary of contents

Page 1

... HFW50N06 / HFI50N06 60V N-Channel MOSFET FEATURES  Originative New Design  Superior Avalanche Rugged Technology  Robust Gate Oxide Technology  Very Low Intrinsic Capacitances  Excellent Switching Characteristics  Unrivalled Gate Charge : 40 nC (Typ.)  Extended Safe Operating Area : 0.018 Ω (Typ.) @V  ...

Page 2

Electrical Characteristics Symbol Parameter On Characteristics V Gate Threshold Voltage GS R Static Drain-Source DS(ON) On-Resistance Off Characteristics BV Drain-Source Breakdown Voltage DSS ΔBV Breakdown Voltage Temperature DSS /ΔT Coefficient J I DSS Zero Gate Voltage Drain Current I Gate-Body ...

Page 3

Typical Characteristics V , Drain-Source Voltage [V] DS Figure 1. On Region Characteristics I , Drain Current [A] D Figure 3. On Resistance Variation vs Drain Current and Gate Voltage 3000 2500 C iss 2000 C oss 1500 1000 C ...

Page 4

Typical Characteristics 1.2 1.1 1.0 0.9 0.8 -100 - Junction Temperature [ J Figure 7. Breakdown Voltage Variation vs Temperature 3 10 Operation in This Area is Limited by R DS(on ...

Page 5

Fig 12. Gate Charge Test Circuit & Waveform 50KΩ 12V 200nF 300nF V GS 3mA Fig 13. Resistive Switching Test Circuit & Waveforms 10V Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms ...

Page 6

Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT I S Driver Gate Pulse Width V -------------------------- Gate Pulse Period ( Driver ) I , Body Diode Forward Current FM I ...

Page 7

Package Dimension ◎ SEMIHOW REV.A0,Mar 2009 ...

Page 8

Package Dimension ◎ SEMIHOW REV.A0,Mar 2009 ...

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