HFI640 SEMIHOW [SemiHow Co.,Ltd.], HFI640 Datasheet

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HFI640

Manufacturer Part Number
HFI640
Description
200V N-Channel MOSFET
Manufacturer
SEMIHOW [SemiHow Co.,Ltd.]
Datasheet
* When mounted on the minimum pad size recommended (PCB Mount)
V
I
I
V
E
I
E
dv/dt
P
T
T
R
R
R
D
DM
AR
D
AS
AR
J
L
HFW640 / HFI640
200V N-Channel MOSFET
DSS
GS
θJC
θ JA
θJA
FEATURES
 Originative New Design
 Superior Avalanche Rugged Technology
 Robust Gate Oxide Technology
 Very Low Intrinsic Capacitances
 Excellent Switching Characteristics
 Unrivalled Gate Charge : 37 nC (Typ.)
 Extended Safe Operating Area
 Lower R
 100% Avalanche Tested
, T
Thermal Resistance Characteristics
Absolute Maximum Ratings
Symbol
Symbol
STG
DS(ON)
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
Power Dissipation (T
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
Junction-to-Case
Junction-to-Ambient*
Junction-to-Ambient
: 0.145 Ω (Typ.) @V
C
A
– Continuous (T
– Continuous (T
– Pulsed
- Derate above 25℃
= 25℃)
Parameter
Parameter
= 25℃)
GS
=10V
T
C
=25℃ unless otherwise specified
C
C
= 25℃)
= 100℃)
(Note 1)
(Note 3)
(Note 1)
(Note 2)
(Note 1)
Typ.
--
--
--
-55 to +150
Value
±30
11.4
13.9
3.13
1.11
200
250
139
300
5.5
18
72
18
BV
R
I
D
1.Gate 2. Drain 3. Source
1
HFW640
D
DS(on) typ
3
2
= 18 A
DSS
Max.
-PAK
62.5
0.9
40
= 200 V
2
1
◎ SEMIHOW REV.A0,Mar 2008
2
= 0.145Ω
3
I
HFI640
Mar 2008
2
-PAK
Units
W/℃
Units
℃/W
V/ns
mJ
mJ
W
W
V
A
A
A
V
A

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HFI640 Summary of contents

Page 1

... HFW640 / HFI640 200V N-Channel MOSFET FEATURES  Originative New Design  Superior Avalanche Rugged Technology  Robust Gate Oxide Technology  Very Low Intrinsic Capacitances  Excellent Switching Characteristics  Unrivalled Gate Charge : 37 nC (Typ.)  Extended Safe Operating Area : 0.145 Ω (Typ.) @V  ...

Page 2

Electrical Characteristics Symbol Parameter On Characteristics V Gate Threshold Voltage GS R Static Drain-Source DS(ON) On-Resistance Off Characteristics BV Drain-Source Breakdown Voltage DSS ΔBV Breakdown Voltage Temperature DSS Coefficient /Δ DSS Zero Gate Voltage Drain Current I Gate-Body ...

Page 3

Typical Characteristics V GS Top: 15.0V 10.0V 8.0V 7.0V 6.5V 6.0V 5.5V Bottom: 5. Drain-Source Voltage [V] DS Figure 1. On Region Characteristics I , Drain Current [A] D Figure 3. On Resistance Variation vs Drain Current and ...

Page 4

Typical Characteristics 1.2 1.1 1.0 0.9 0.8 -100 - Junction Temperature [ J Figure 7. Breakdown Voltage Variation vs Temperature Operation in This Area is Limited DS(on ...

Page 5

Fig 12. Gate Charge Test Circuit & Waveform 50KΩ 12V 200nF 300nF V GS 3mA Fig 13. Resistive Switching Test Circuit & Waveforms 10V Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms ...

Page 6

Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT I S Driver Gate Pulse Width V -------------------------- Gate Pulse Period ( Driver ) I , Body Diode Forward Current FM I ...

Page 7

Package Dimension ◎ SEMIHOW REV.A0,Mar 2008 ...

Page 8

Package Dimension ◎ SEMIHOW REV.A0,Mar 2008 ...

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