NC7SZ58L6X Fairchild Semiconductor, NC7SZ58L6X Datasheet

NC7SZ58L6X

Manufacturer Part Number

NC7SZ58L6X

Description

IC LOGIC GATE UHS 2-INP 6-MCRPAK

Manufacturer

Fairchild Semiconductor

Series

7SZr

Datasheet

1.NC7SZ58P6X.pdf (13 pages)

Specifications of NC7SZ58L6X

Logic Type

Configurable Multiple Function

Number Of Circuits

Number Of Inputs

Schmitt Trigger Input

Output Type

Single-Ended

Current - Output High, Low

32mA, 32mA

Voltage - Supply

1.65 V ~ 5.5 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

6-MicroPak™

Product

MUX Gates

Logic Family

NC7SV

High Level Output Current

- 32 mA

Low Level Output Current

32 mA

Propagation Delay Time

6 ns

Supply Voltage (max)

5.5 V

Supply Voltage (min)

1.65 V

Maximum Operating Temperature

+ 85 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 40 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

NC7SZ58L6X

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Leng, HooiChin

E-mail: HooiChin.Leng@notes.fairchildsemi.com

Phone: 604-8502370

Implementation of change:

Expected 1st Device Shipment Date: 2009/01/02

Earliest Year/Work Week of Changed Product: 0901

Change Type Description: Die Attach Material, Mold Compound

Description of Change (From): Fairchild's Micropak packages currently assembled at

Hana-Ayutthaya using non-green mold compound and substrate materials.

Description of Change (To): Green, Halogen Free RoHS compliant packages. The Micropak

packages assembled at Hana-Ayutthaya will be Green with the changes to mold compound and

the substrate. (Note: Two mold compounds have been qualified to support the change to green

materials and based on performance, can be interchanged.) Also refer to the tables below for

comparisons of this change.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. The reference material changes have been made to

provide a Full Green (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html. Package outline drawings of the

Micropak packages will remain unchanged. Green products will be fully compliant to all

published datasheet specifications and will be interchangeable with current non-green product.

Quality and Reliability will remain at the highest standards already demonstrated with Fairchild

existing products.

Qual/REL Plan Numbers : Q20070331

Qualification :

Attached are the Reliability Test results to qualify the Green conversion of the Micropak

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Leng, HooiChin

E-mail: HooiChin.Leng@notes.fairchildsemi.com

Phone: 604-8502370

Date Issued On : 2008/10/03

Date Created : 2008/08/05

PCN# : Q3083202

Pg. 1

Related parts for NC7SZ58L6X

NC7SZ58L6X Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Hana-Ayutthaya. Change From Change To Results/Discussion for Qual Plan Number - Q20070331 Test: (Autoclave) | Conditions: 100%RH, 121C | Standard: JESD22-A102 Lot Device Q20070331AAACLVB FSA2257L10X Q20070331BAACLVB NC7SZ125L6X Q20070331CAACLVB FHP3131IL6X Q20070331DAACLVB NC7SZ74L8X Test: (C Scanning Acoustical Microscope) | ...

Page 3

... Device Q20070331AATMCL1B FSA2257L10X Q20070331BATMCL1B NC7SZ125L6X Q20070331DATMCL1B NC7SZ74L8X Product Id Description : This change notification covers Fairchild Semiconductor Micropak 6-Lead, 8-Lead and 10-lead Micropak packages assembled at Hana. Please refer to the Affected FSID listing below for specific part numbers. Affected FSIDs : FHP3131IL6X FSA1156L6X FSA1157L6X_F087 FSA1257AL8X ...

Page 4

... FXLH1T45L6X FXLP34L6X_F087 NC7NP34L8X NC7NZ17L8X NC7S00L6X NC7S08L6X NC7S86L6X NC7SP00L6X_F087 NC7SP04L6X NC7SP08L6X NC7SP126L6X NC7SP157L6X_F087 NC7SP19L6X NC7SP38L6X NC7SP74L8X NC7SPU04L6X NC7ST04L6X NC7ST32L6X_F087 NC7SV00L6X NC7SV04L6X NC7SV08L6X NC7SV125L6X NC7SV157L6X NC7SV17L6X NC7SV32L6X_F087 NC7SV38L6X NC7SV58L6X NC7SV74L8X_F087 NC7SZ00L6X NC7SZ04L6X_F087 NC7SZ08L6X_F087 NC7SZ11L6X_F087 NC7SZ126L6X NC7SZ14L6X_F087 NC7SZ175L6X NC7SZ19L6X NC7SZ32L6X NC7SZ332L6X_F087 NC7SZ386L6X NC7SZ57L6X NC7SZ58L6X_F065 Pg. 4 ...

Page 5

... NC7SZ58L6X_F087 NC7SZ74L8X_F087 NC7WB66L8X NC7WP02L8X NC7WP125L8X NC7WP32L8X NC7WV07L6X_F065 NC7WV17L6X NC7WZ02L8X NC7WZ07L6X NC7WZ08L8X_F087 NC7WZ126L8X NC7WZ14L6X_F065 NC7WZ16L6X_F065 NC7WZ17L6X_F065 NC7WZ241L8X NC7WZ86L8X NC7WZU04L6X_F065 NC7SZ66L6X NC7SZ86L6X NC7WB66L8X_F087 NC7WP02L8X_F087 NC7WP14L6X NC7WV04L6X NC7WV14L6X NC7WZ00L8X NC7WZ04L6X NC7WZ07L6X_F065 NC7WZ125L8X NC7WZ132L8X NC7WZ14L6X_F087 NC7WZ16L6X_F087 NC7WZ17L6X_F087 NC7WZ32L8X NC7WZ86L8X_F087 NC7SZ74L8X NC7SZU04L6X NC7WP00L8X NC7WP08L8X NC7WP240L8X NC7WV07L6X ...

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