T-8110L AGERE [Agere Systems], T-8110L Datasheet - Page 126

• Manufacturer Part Number: T-8110L
• Manufacturer: AGERE [Agere Systems]

Ambassador T8110L H.100/H.110 Switch
13 Electrical Characteristics
13.2 Crystal Specifications
13.2.3 Reset Pulse
Table 104. Reset Pulse
13.3 Thermal Parameters (Definitions and Values)
System and circuit board level performance depends not only on device electrical characteristics, but also on device
thermal characteristics. The thermal characteristics frequently determine the limits of circuit board or system perfor-
mance, and they can be a major cost adder or cost avoidance factor. When the die temperature is kept below 125
°C, temperature activated failure mechanisms are minimized. The thermal parameters that Agere provides for its
packages help the chip and system designer choose the best package for their applications, including allowing the
system designer to thermally design and integrate their systems.
It should be noted that all the parameters listed below are affected, to varying degrees, by package design (including
paddle size) and choice of materials, the amount of copper in the test board or system board, and system airflow.
ditions.
a wind tunnel with forced air convection.
correspond to
1 m/s and 2.5 m/s (respectively).
of the heat generated in the die out the top of the package by lowering the top case temperature. This is done by
placing the top of the package in contact with a copper slug kept at room temperature using a liquid refrigeration
unit.
126
RESET# Minimum Pulse Width
JA
JA
JA
JMA
JMA
JMA
JC
JC
JC
—Junction to Air Thermal Resistance
—Junction to Case Thermal Resistance
is a number used to express the thermal performance of a part under JEDEC standard natural convection con-
is the thermal resistance from junction to the top of the case. This number is determined by forcing nearly 100%
= (T
= (T
—Junction to Moving Air Thermal Resistance
is effectively identical to
= (T
JC
J
J
is calculated using the following formula:
JA
– T
J
– T
– T
is calculated using the following formula:
amb
C
)/P
amb
)/P; where P = power
)/P
Parameter
JA
but represents performance of a part mounted on a JEDEC four layer board inside
(continued)
JMA
is calculated using the following formula:
(continued)
JMA
is reported at airflows of 200 lft./min and 500 lft./min, which roughly
Min
61
Max
—
Agere Systems Inc.
February 2004
Unit
ns