HI-3588 HOLTIC [Holt Integrated Circuits], HI-3588 Datasheet - Page 11
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HI-3588
Manufacturer Part Number
HI-3588
Description
ARINC 429 Receiver with SPI Interface
Manufacturer
HOLTIC [Holt Integrated Circuits]
Datasheet
1.HI-3588.pdf
(11 pages)
(1.00)
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
.039
44-PIN PLASTIC QUAD FLAT PACK (PQFP)
max
(7.00)
.276
BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
(1.6)
.063
MAX.
(13.90 ± .25)
.547 ± .010
SQ.
Top View
(7.00)
.276
BSC
See Detail A
HOLT INTEGRATED CIRCUITS
(0.2)
.008
typ
.394 ± .004
(10.0 ± .10)
SQ.
HI-3588 PACKAGE DIMENSIONS
11
Heat sink pad on bottom of package.
Heat sink must be left floating or
DO NOT connect to GND.
.055 .002
(1.4 .05)
(5.15 ± .15)
.203 ± .006
connected to VDD.
±
±
(.13)
.005
R MIN.
(5.15 ± .15)
.203 ± .006
(.15)
.006
Bottom
View
Detail A
.0315
(.80)
.035 .006
(.30)
(.88 .15)
.012
Package Type: 44PCS
MAX.
inches (millimeters)
inches (millimeters)
Package Type:
.014 ± ..002
(.35 ± .05)
±
±
R MAX.
BSC
(0.40 ± .05)
.016 ± .002
0° £ Q £ 7°
44PTQS
(0.25)
(0.50)
.010
.020
BSC
typ