MF1S5009DA4 NXP [NXP Semiconductors], MF1S5009DA4 Datasheet
MF1S5009DA4
Related parts for MF1S5009DA4
MF1S5009DA4 Summary of contents
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MF1S5009 Mainstream contactless smart card IC for fast and easy solution development Rev. 3 — 27 July 2010 189131 1. General description NXP Semiconductors has developed the MIFARE MF1S5009 to be used in a contactless smart card according to ISO/IEC ...
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NXP Semiconductors 1.4 Security • Unique identifier for each device using double size UID (7 byte UID) • Mutual three pass authentication (ISO/IEC 9798-2) • Individual set of two keys per sector (per application) to support multi-application with key hierarchy ...
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... Public transportation Access management Electronic toll collection Car parking School and campus cards Employee cards Internet cafés Loyalty 4. Ordering information Table 1. Type number MF1S5009DUD MF1S5009DA4 5. Block diagram INTERFACE POWER ON REGULATOR INPUT FILTER GENERATOR Fig 2. MF1S5009 Product data sheet PUBLIC Ordering information ...
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... Chip dimensions step size MF1S5009 Product data sheet PUBLIC LA Contact assignments for SOT500-2 (MOA4) Bonding pad assignments to smart card contactless module MF1S5009DA4 Symbol Description LA Antenna coil connection LA LB Antenna coil connection LB Specifications All information provided in this document is subject to legal disclaimers. ...
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NXP Semiconductors Table 3. gap between chips Passivation type material thickness Au bump (substrate connected to VSS) material hardness shear strength height height uniformity flatness size size variation under bump metallization [1] The gap between chips may vary due to ...
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NXP Semiconductors 8. Chip orientation and bond pad locations typ. 15.0 min. 5.0 1071.0 (1) The air gap may vary due to varying foil expansion (2) Measured from outer sealring edge (see detail) Fig 4. Chip orientation and bond pad ...
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NXP Semiconductors 9. Functional description 9.1 Block description The MF1S5009 chip consists EEPROM, RF interface and Digital Control Unit. Energy and data are transferred via an antenna consisting of a coil with a small number of ...
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NXP Semiconductors 9.2.3 Select card With the select card command the reader selects one individual card for authentication and memory related operations. The card returns the Select Acknowledge (SAK) code which determines the type of the selected card, see to ...
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NXP Semiconductors 9.2.5 Memory operations After authentication any of the following operations may be performed: • Read block • Write block • Decrement: Decrements the contents of a block and stores the result in a temporary internal data-register • Increment: ...
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NXP Semiconductors 9.5 RF interface The RF-interface is according to the standard for contactless smart cards ISO/IEC 14443 A. The carrier field from the reader is always present (with short pauses when transmitting), because it is used for the power ...
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NXP Semiconductors 9.6.1 Manufacturer block This is the first data block (block 0) of the first sector (sector 0). It contains the IC manufacturer data. This block is programmed and write protected in the production test. Fig 7. 9.6.2 Data ...
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NXP Semiconductors 9.6.3 Sector trailer (block 3) Each sector has a sector trailer containing the • secret keys A and B (optional), which return logical “0”s when read and • the access conditions for the four blocks of that sector, ...
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NXP Semiconductors 9.7.1 Access conditions The access conditions for every data block and sector trailer are defined by 3 bits, which are stored non-inverted and inverted in the sector trailer of the specified sector. The access bits control the rights ...
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NXP Semiconductors 9.7.2 Access conditions for the sector trailer Depending on the access bits for the sector trailer (block 3) the read/write access to the keys and the access bits is specified as ‘never’, ‘key A’, ‘key B’ or key ...
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NXP Semiconductors Table 7. Access bits [1] if Key B may be read in the corresponding Sector Trailer it cannot serve for ...
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NXP Semiconductors 10. Command overview The MIFARE card activation follows the ISO/IEC 14443-3 type A. After the MIFARE card has been selected, it can either be deactivated using the ISO/IEC 14443 Halt command, or the MIFARE commands can be performed. ...
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NXP Semiconductors All timing can be measured according to ISO/IEC 14443-3 frame specification as shown for the Frame Delay Time in FDTPCD2PICC = Frame delay time PCD to PICC. FDTPICC2PCD = Frame delay time PICC to PCD (must be at ...
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NXP Semiconductors 10.4 ATQA and SAK responses For details on the type identification procedure please refer to The MF1S5009 answers to a REQA or WUPA command with the ATQA value shown in Table 10 Table 10. Response ATQA Table 11. ...
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NXP Semiconductors 11. MIFARE classic commands 11.1 MIFARE Authentication The MIFARE authentication is a 3-pass mutual authentication which needs two pairs of command-response. These two parts, MIFARE authentication part 1 and part 2 are shown in Figure Table 13 PCD ...
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NXP Semiconductors Table 12. Name Auth (with Key A) Auth (with Key B) Addr CRC Token RB Token AB Token BA NAK Table 13. These times exclude the end of communication of the PCD. Authentication part 1 Authentication part 2 ...
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NXP Semiconductors Table 14. Name Cmd Addr CRC Data NAK Table 15. These times exclude the end of communication of the PCD. Read 11.3 MIFARE Write The MIFARE Write requires a block address, and writes 16 Bytes of data into ...
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NXP Semiconductors Fig 16. MIFARE Write part 2 Table 16. Name Cmd Addr CRC Data NAK Table 17. These times exclude the end of communication of the PCD. Write part 1 Write part 2 Remark: The minimum required time between ...
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NXP Semiconductors Fig 17. MIFARE Increment, Decrement and Restore part 1 (1) Increment, Decrement and Restore part 2 does not acknowledge Fig 18. MIFARE Increment, Decrement and Restore part 2 Table 18. Name Cmd Cmd Cmd Addr CRC Data NAK ...
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NXP Semiconductors Table 19. These times exclude the end of communication of the PCD. Increment, Decrement, and Restore part 1 Increment, Decrement, and Restore part 2 Remark: The minimum required time between MIFARE Increment, Decrement, and Restore part 1 and ...
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NXP Semiconductors Table 20. Name Cmd Addr CRC NAK Table 21. These times exclude the end of communication of the PCD. Transfer 12. Limiting values Table 22. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I I ...
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NXP Semiconductors 14. Package outline PLLMC: plastic leadless module carrier package wide tape DIMENSIONS (mm are the original dimensions) (1) A UNIT D max. For unspecified dimensions see PLLMC-drawing given in the subpackage code. 35.05 mm 0.33 34.95 ...
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NXP Semiconductors 15. Abbreviations Table 24. Acronym ATQA CRC EEPROM FFC IC LCR LSB NAK NUID NV PCD PICC REQA RF RMS SAK SECS-II TiW UID WUPA 16. References [1] MIFARE (Card) Coil Design Guide — Application note, BU-ID Document ...
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NXP Semiconductors 17. Revision history Table 25. Revision history Document ID Release date MF1S5009 v.3.1 20100727 • Modifications: All drawings updated MF1S5009 v.3.0 20100610 MF1S5009 Product data sheet PUBLIC Data sheet status Product data sheet Product data sheet All information ...
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NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use neither qualified nor tested in accordance with automotive testing ...
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NXP Semiconductors 20. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Table 2. Bonding pad assignments to smart card contactless module . ...
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NXP Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Key applications . . . . . . . ...