MF1S5009DA4 NXP [NXP Semiconductors], MF1S5009DA4 Datasheet - Page 6

• Manufacturer Part Number: MF1S5009DA4
• Description: Mainstream contactless smart card IC for fast and easy solution development
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
8. Chip orientation and bond pad locations
MF1S5009
Product data sheet
PUBLIC
Fig 4. Chip orientation and bond pad locations
(1) The air gap may vary due to varying foil expansion
(2) Measured from outer sealring edge (see detail)
typ. 15.0
1071.0
min. 5.0
All dimensions in μm
Y
(2)
(1)
All information provided in this document is subject to legal disclaimers.
X
Rev. 3 — 27 July 2010
52.3
239.2
typ. 15.0
min. 5.0
51.3
TP1
368.7
(2)
(2)
(2)
189131
556.6
(2)
TP2
(1)
LA
(2)
807.7
Dimensions in μm
VSS
(2)
1231.0
1070.0
(1)
LB
Mainstream contactless smart card IC
Bump size
LA, LB
VSS, TP1, TP2
Chip Step
(2)
52.9
(2)
x (μm)
69
58
1231
(1)
typ. 36.4
min. 26.4
MF1S5009
y (μm)
69
58
1280
© NXP B.V. 2010. All rights reserved.
typ. 36.4
min. 26.4
(1)(2)
(1)
001aam201
1280.0
(1)(2)
(1)
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