S9S12G64F0MLH Freescale Semiconductor, S9S12G64F0MLH Datasheet - Page 1288
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
S9S12G64F0MLH
Manufacturer Part Number
S9S12G64F0MLH
Description
16-bit Microcontrollers - MCU S12 Core,64k Flash
Manufacturer
Freescale Semiconductor
Datasheet
1.S9S12G96F0CLL.pdf
(1292 pages)
Specifications of S9S12G64F0MLH
Rohs
yes
Core
S12
Processor Series
MC9S12G
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
Program Memory Size
64 KB
Data Ram Size
2 KB
On-chip Adc
Yes
Operating Supply Voltage
3.13 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-64
Mounting Style
SMD/SMT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S9S12G64F0MLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
S9S12G64F0MLH
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
S9S12G64F0MLHR
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Package and Die Information
1290
Die Pad
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Bond Post
MC9S12G Family Reference Manual,
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
-1315.5
-1134.5
1120.5
1242.5
1412.5
1582.5
-964.5
-794.5
-660.5
-526.5
-404.5
-292.5
-190.5
-105.5
189.5
291.5
403.5
525.5
659.5
805.5
964.5
93.5
-0.5
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Die Pad
-1347.5
-1139.5
-1022.5
-905.5
-788.5
-681.5
-574.5
Rev.1.23
Function
VDDX3
VSSX3
PAD[0]
PAD[8]
PAD[1]
PB[3]
PP[0]
PP[1]
PP[2]
PP[3]
PP[4]
PP[5]
PP[6]
PP[7]
PB[4]
PB[5]
PB[6]
PB[7]
PC[0]
PC[1]
PC[2]
PC[3]
PT[7]
PT[6]
PT[5]
PT[4]
PT[3]
PT[2]
PT[1]
PT[0]
Freescale Semiconductor
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