LPC11U24FBD48/301, NXP Semiconductors, LPC11U24FBD48/301, Datasheet - Page 62

• Manufacturer Part Number: LPC11U24FBD48/301,
• Description: ARM Microcontrollers - MCU CortexM0 32bit 32KB with USB
• Manufacturer: NXP Semiconductors

Specifications of LPC11U24FBD48/301,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11U2x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 6 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.3 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: LQFP-48
• Mounting Style: SMD/SMT
• Data Rom Size: 2 KB
• Number Of Programmable I/os: 40
• Number Of Timers: 4
• Factory Pack Quantity: 250

NXP Semiconductors
LPC11U2X
Product data sheet
Fig 38. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 2 — 13 January 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11U2x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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