S29GL512S10FHI010 Spansion, S29GL512S10FHI010 Datasheet - Page 82

• Manufacturer Part Number: S29GL512S10FHI010
• Description: Flash 512Mb 3V 100ns Parallel NOR Flash
• Manufacturer: Spansion

Specifications of S29GL512S10FHI010

• Rohs: yes
• Data Bus Width: 16 bit
• Memory Type: Flash
• Memory Size: 512 Mbit
• Architecture: 32 M x 16
• Timing Type: Asynchronous
• Interface Type: Parallel
• Access Time: 100 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 25 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: FBGA-64

18. Physical Dimensions
18.1
82
PACKAGE
SYMBOL
JEDEC
D1
A1
A2
b1
c1
A
D
E
O
R
N
b
c
e
L
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
19.80
18.30
13.90
MIN.
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
---
0˚
MO-142 (B) EC
0.50 BASIC
TS 56
NOM.
20.00
18.40
14.00
1.00
0.20
0.22
0.60
56
---
---
---
---
---
-
20.20
18.50
14.10
MAX.
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
8˚
NOTES:
1
2
3
4
5
6
7
8
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
S29GL-N
D a t a
S h e e t
S29GL-N_00_B8 May 30, 2008
3160\38.10A