S9S08SG8E2VTG Freescale Semiconductor, S9S08SG8E2VTG Datasheet - Page 32

• Manufacturer Part Number: S9S08SG8E2VTG
• Description: 8-bit Microcontrollers - MCU 9S08 UC W/ 8K 0.25UM SGF
• Manufacturer: Freescale Semiconductor

Specifications of S9S08SG8E2VTG

• Rohs: yes
• Core: S08
• Processor Series: MC9S08SG8
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 40 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2.7 V to 5.5 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: TSSOP-16
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Interface Type: SCI, SPI
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 16
• Number Of Timers: 2
• Program Memory Type: Flash
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 2.7 V

Chapter 2 Pins and Connections
for the overall system and a 0.1-F ceramic bypass capacitor located as near to the MCU power pins as
practical to suppress high-frequency noise. Each pin must have a bypass capacitor for best noise
suppression.
2.2.2
Immediately after reset, the MCU uses an internally generated clock provided by the clock source
generator (ICS) module. For more information on the ICS, see
(S08ICSV2).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
Refer to
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
is not generally critical. Typical systems use 1 M to 10 M. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
2.2.3
RESET is a dedicated pin with open-drain drive containing an internal pull-up device. Internal power-on
reset and low-voltage reset circuitry typically make external reset circuitry unnecessary. This pin is
normally connected to the standard 6-pin background debug connector so a development system can
directly reset the MCU system. If desired, a manual external reset can be added by supplying a simple
switch to ground (pull reset pin low to force a reset).
Whenever any reset is initiated (whether from an external signal or from an internal system), the RESET
pin is driven low for about 66 bus cycles. The reset circuitry decodes the cause of reset and records it by
setting a corresponding bit in the system reset status register (SRS).
28
F
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
Figure 2-4
Oscillator (XOSC)
RESET Pin
This pin does not contain a clamp diode to V
above V
for the following discussion. R
DD
.
MC9S08SG8 MCU Series Data Sheet, Rev. 7
NOTE
S
(when used) and R
DD
Chapter 10, “Internal Clock Source
and should not be driven
F
should be low-inductance
Freescale Semiconductor