BSP762TNT Infineon Technologies, BSP762TNT Datasheet

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BSP762TNT

Manufacturer Part Number
BSP762TNT
Description
Power Switch ICs - Power Distribution Smart High Side MINI-PROFET
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSP762TNT

Product Category
Power Switch ICs - Power Distribution
Number Of Outputs
1
On Resistance (max)
100 mOhms
On Time (max)
170 us
Off Time (max)
230 us
Supply Current (max)
1.3 mA
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
DSO-8-6
Maximum Power Dissipation
1.5 W
Minimum Operating Temperature
- 40 C
Output Current
2 A
Factory Pack Quantity
2500
Smart Power High-Side-Switch
Features
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,
monolithically integrated in Smart SIPMOS
Providing embedded protective functions.
Application
Current limitation
Reverse battery protection with external resistor
Overload protection
Short circuit protection
Thermal shutdown with restart
Overvoltage protection (including load dump)
Fast demagnetization of inductive loads
CMOS compatible input
Loss of GND and loss of V
ESD - Protection
Very low standby current
All types of resistive, inductive and capacitive loads
µC compatible power switch for 12 V and 24 V DC applications
Replaces electromechanical relays and discrete circuits
bb
protection
Product Summary
Overvoltage protection
Operating voltage
On-state resistance
Nominal load current
Page 1
technology.
V
V
R
I
L(nom)
bb(AZ)
bb(on)
ON
2004-01-27
BSP 762 T
5...34 V
100
41
2
V
m
A

Related parts for BSP762TNT

BSP762TNT Summary of contents

Page 1

... Very low standby current Application All types of resistive, inductive and capacitive loads µC compatible power switch for 12 V and applications Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET with charge pump, ground referenced CMOS compatible input, monolithically integrated in Smart SIPMOS Providing embedded protective functions ...

Page 2

... GND Signal GND Function Logic ground Input, activates the power switch in case of logic high signal Output to the load not connected Positive power supply voltage Positive power supply voltage Positive power supply voltage Positive power supply voltage Vbb ...

Page 3

Maximum Ratings 25°C, unless otherwise specified j Parameter Supply voltage Supply voltage for full short circuit protection = -40...+150° Continuous input voltage Load current (Short - circuit current, see page 5) Current through input pin ...

Page 4

Electrical Characteristics Parameter and Conditions -40...+150° 13,5V Load Switching Capabilities and Characteristics On-state resistance = 25 ° 9... 150 °C T ...

Page 5

Electrical Characteristics Parameter and Conditions -40...+150° 13,5V Protection Functions Initial peak short circuit current limit (pin -40 ° ...

Page 6

Electrical Characteristics Parameter and Conditions -40...+150° 13,5V Input Input turn-on threshold voltage (see page 12) Input turn-off threshold voltage (see page 12) Input threshold hysteresis Off state input current (see page 12) V ...

Page 7

Terms PROFET V IN GND V I GND bb R GND Input circuit (ESD protection ESD GND The use of ESD zener diodes as voltage clamp ...

Page 8

GND disconnect PROFET GND GND GND disconnect with GND pull OUT PROFET GND GND disconnect with charged inductive load high OUT ...

Page 9

Typ. transient thermal impedance 6cm heatsink area thJA p Parameter: D D=0.5 K/W D=0.2 D=0 D=0.05 D=0. D=0.01 D ...

Page 10

Typ. turn on time 160 µs 120 100 -40 - Typ. slew rate on dV/ ...

Page 11

Typ. standby current 32V ; V bb(off µ -40 - Typ. initial peak short circuit current limit I = f(T ...

Page 12

Typ. input current 13,5V; V IN(on/off 0,7V low high 14 µ -40 - Typ. input threshold ...

Page 13

Maximum allowable load inductance for a single switch off =150° jstart bb 3000 mH 2000 1500 1000 500 0 0 0.5 1 Maximum allowable inductive switch-off energy, single pulse =13.5V ...

Page 14

Timing diagrams Figure 1a: Vbb turn on OUT Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition ...

Page 15

Figure 3a: Turn on into short circuit, shut down by overtemperature, restart by cooling L(SCp) I L(SCr off(SC) Heating up of the chip may require several milliseconds, depending on external conditions. Figure 4: ...

Page 16

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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