NX3008NBKW,115 NXP Semiconductors, NX3008NBKW,115 Datasheet - Page 3

no-image

NX3008NBKW,115

Manufacturer Part Number
NX3008NBKW,115
Description
MOSFET 30V 350 MA N-CH TRENCH MOSFET
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NX3008NBKW,115

Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
8 V
Continuous Drain Current
350 mA
Resistance Drain-source Rds (on)
1.4 Ohms
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-323-3
Fall Time
19 ns
Forward Transconductance Gfs (max / Min)
310 mS
Gate Charge Qg
0.52 nC
Minimum Operating Temperature
- 55 C
Power Dissipation
310 mW
Rise Time
11 ns
Factory Pack Quantity
3000
Typical Turn-off Delay Time
69 ns
NXP Semiconductors
5. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
NX3008NBKW
Product data sheet
Symbol
V
V
I
I
P
T
T
T
Source-drain diode
I
ESD maximum rating
V
D
DM
S
j
amb
stg
DS
GS
tot
ESD
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Measured between all pins.
Limiting values
Parameter
drain-source voltage
gate-source voltage
drain current
peak drain current
total power dissipation
junction temperature
ambient temperature
storage temperature
source current
electrostatic discharge voltage
All information provided in this document is subject to legal disclaimers.
Conditions
T
V
V
T
T
T
T
HBM
Rev. 1 — 2 August 2011
j
amb
amb
sp
amb
GS
GS
= 25 °C
= 25 °C
= 4.5 V; T
= 4.5 V; T
= 25 °C; single pulse; t
= 25 °C
= 25 °C
amb
amb
= 25 °C
= 100 °C
30 V, 350 mA N-channel Trench MOSFET
p
≤ 10 µs
2
.
NX3008NBKW
[1]
[1]
[2]
[1]
[1]
[3]
Min
-
-8
-
-
-
-
-
-
-55
-55
-65
-
-
© NXP B.V. 2011. All rights reserved.
150
150
150
Max
30
8
350
230
1.4
260
310
830
300
2000
Unit
V
V
mA
mA
A
mW
mW
mW
°C
°C
°C
mA
V
3 of 16

Related parts for NX3008NBKW,115