BUK9675-100A /T3 NXP Semiconductors, BUK9675-100A /T3 Datasheet - Page 4

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BUK9675-100A /T3

Manufacturer Part Number
BUK9675-100A /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9675-100A /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
23 A
Resistance Drain-source Rds (on)
0.072 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
57 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
98 W
Rise Time
120 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
58 ns
Part # Aliases
BUK9675-100A,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9675-100A
Product data sheet
Symbol
R
R
Fig 5.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
1
10
−6
All information provided in this document is subject to legal disclaimers.
0.2
0.1
0.05
0.02
0
δ
= 0.5
Conditions
Minimum footprint; FR4 board
10
−5
Rev. 04 — 19 April 2011
10
−4
10
−3
P
10
−2
t
p
T
10
003aaf173
−1
δ =
t
p
(s)
N-channel TrenchMOS logic level FET
T
t
t
p
1
BUK9675-100A
Min
-
-
Typ
-
50
© NXP B.V. 2011. All rights reserved.
-
Max
1.5
Unit
K/W
K/W
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