PHB18NQ10T /T3 NXP Semiconductors, PHB18NQ10T /T3 Datasheet - Page 8

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PHB18NQ10T /T3

Manufacturer Part Number
PHB18NQ10T /T3
Description
MOSFET TRENCH-100
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PHB18NQ10T /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
18 A
Resistance Drain-source Rds (on)
0.09 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
12 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
79 W
Rise Time
36 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
18 ns
Part # Aliases
PHB18NQ10T,118
NXP Semiconductors
7. Package outline
Fig 16. Package outline SOT404 (D2PAK)
PHB18NQ10T
Product data sheet
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT404
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
0.64
0.46
c
max.
1
D
11
e
All information provided in this document is subject to legal disclaimers.
E
JEDEC
1.60
1.20
D 1
2
e
REFERENCES
Rev. 02 — 17 December 2010
10.30
9.70
E
3
0
b
2.54
e
JEITA
scale
2.5
2.90
2.10
L p
5 mm
15.80
14.80
H D
N-channel TrenchMOS standard level FET
mounting
2.60
2.20
Q
base
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
PHB18NQ10T
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-02-11
06-03-16
SOT404
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