BUK963R2-40B /T3 NXP Semiconductors, BUK963R2-40B /T3 Datasheet - Page 2

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BUK963R2-40B /T3

Manufacturer Part Number
BUK963R2-40B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK963R2-40B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
222 A
Resistance Drain-source Rds (on)
0.0028 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
192 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
300 W
Rise Time
268 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
257 ns
Part # Aliases
BUK963R2-40B,118
NXP Semiconductors
2. Pinning information
Table 2.
[1]
3. Ordering information
Table 3.
BUK963R2-40B
Product data sheet
Pin
1
2
3
mb
Type number
BUK963R2-40B
It is not possible to make connection to pin 2.
Symbol Description
G
D
S
D
Pinning information
Ordering information
gate
drain
source
mounting base; connected to
drain
Table 1.
[1]
Package
Name
D2PAK
Symbol
Avalanche ruggedness
E
Dynamic characteristics
Q
[1]
DS(AL)S
GD
All individual parts of device must be ≤ 175 °C to achieve maximum current rating.
Quick reference data
Parameter
non-repetitive
drain-source
avalanche energy
gate-drain charge V
Description
plastic single-ended surface-mounted package (D2PAK);
3 leads (one lead cropped)
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 16 February 2011
Simplified outline
SOT404 (D2PAK)
Conditions
I
R
T
V
see
D
…continued
j(init)
GS
DS
GS
= 100 A; V
Figure 13
= 5 V; I
= 32 V; T
= 50 Ω; V
= 25 °C; unclamped
1
mb
2
3
D
sup
= 25 A;
j
GS
= 25 °C;
≤ 40 V;
= 5 V;
N-channel TrenchMOS logic level FET
Graphic symbol
BUK963R2-40B
mbb076
G
Min
-
-
© NXP B.V. 2011. All rights reserved.
D
S
Typ
-
37
Version
SOT404
Max Unit
1.2
-
2 of 13
J
nC

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