BUK7208-40B /T3 NXP Semiconductors, BUK7208-40B /T3 Datasheet - Page 5

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BUK7208-40B /T3

Manufacturer Part Number
BUK7208-40B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK7208-40B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
105 A
Resistance Drain-source Rds (on)
0.008 Ohms
Configuration
Single
Maximum Operating Temperature
+ 185 C
Mounting Style
SMD/SMT
Package / Case
SOT-428
Fall Time
51 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
167 W
Rise Time
104 ns
Factory Pack Quantity
2500
Typical Turn-off Delay Time
47 ns
Part # Aliases
BUK7208-40B,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK7208-40B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
δ = 0.5
−6
0.1
0.05
0.02
0.2
single shot
10
−5
All information provided in this document is subject to legal disclaimers.
10
−4
Rev. 03 — 7 June 2010
Conditions
see
10
−3
Figure 4
10
N-channel TrenchMOS standard level FET
−2
P
10
t
p
−1
T
t
BUK7208-40B
p
Min
-
-
δ =
(s)
03nk52
t
T
t
p
1
Typ
-
71.4
© NXP B.V. 2010. All rights reserved.
Max
0.95
-
Unit
K/W
K/W
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