MT48LC4M32B2P-7:G Micron Technology Inc, MT48LC4M32B2P-7:G Datasheet - Page 34

IC SDRAM 128MBIT 143MHZ 86TSOP

MT48LC4M32B2P-7:G

Manufacturer Part Number
MT48LC4M32B2P-7:G
Description
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2P-7:G

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TSOPII
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
175mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Figure 26:
Burst READ/Single WRITE
Concurrent Auto Precharge
READ with Auto Precharge
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
CLOCK SUSPEND During READ Burst
Notes:
1. Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
2. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
COMMAND
1. For this example, CL = 2, BL = 4 or greater, and DQM is LOW.
The burst read/single write mode is entered by programming the write burst mode bit
(M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the
access of a single column location (burst of one), regardless of the programmed BL.
READ commands access columns according to the programmed BL and sequence, just
as in the normal mode of operation (M9 = 0).
An access command to (READ or WRITE) another bank while an access command with
auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM
supports concurrent auto precharge. Micron SDRAMs support concurrent auto
precharge. Four cases where concurrent auto precharge occurs are defined below.
INTERNAL
ADDRESS
rupt a READ on bank n, CL later. The precharge to bank n will begin when the READ
to bank m is registered (see Figure 27 on page 35).
interrupt a READ on bank n when registered. DQM should be used two clocks prior to
the WRITE command to prevent bus contention. The precharge to bank n will begin
when the WRITE to bank m is registered (see Figure 28 on page 35).
CLOCK
CKE
CLK
DQ
T0
BANK,
COL n
READ
T1
NOP
T2
NOP
D
OUT
n
34
T3
n + 1
D
OUT
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T4
NOP
T5
NOP
n + 2
D
OUT
DON’T CARE
T6
NOP
D
n + 3
OUT
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition

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