MT46H64M32L2CG-6 IT:A TR Micron Technology Inc, MT46H64M32L2CG-6 IT:A TR Datasheet
MT46H64M32L2CG-6 IT:A TR
Specifications of MT46H64M32L2CG-6 IT:A TR
Related parts for MT46H64M32L2CG-6 IT:A TR
MT46H64M32L2CG-6 IT:A TR Summary of contents
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Mobile LPDDR (only) 152-Ball Package-on-Package (PoP) TI-OMAP™ MT46HxxxMxxLxCG MT46HxxxMxxLxKZ Features • 1.70–1.95V / DD DDQ • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR) architecture; 2 data accesses per clock ...
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Part Numbering Information – 152-Ball PoP Micron Figure 1: Marketing Part Number Example MT Micron Technology Product Family 46 = LPDDR-SDRAM Operating Voltage H = 1.8V/1.8V Configuration 128 Meg Meg Meg ...
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... MT46H32M32LFCG-54 IT:A MT46H32M32LFCG-6:A MT46H32M32LFCG-6 IT:A MT46H64M32L2CG-5:A MT46H64M32L2CG-5 IT:A MT46H64M32L2CG-54:A MT46H64M32L2CG-54 IT:A MT46H64M32L2CG-6:A MT46H64M32L2CG-6 IT:A MT46H128M32L4KZ-6 IT ES:A Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanu- meric code is used ...
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... Micron 152-ball packaged Mobile Low-Power DDR SDRAM (LPDDR) devices contain either 1Gb LPDDR or 512Mb LPDDR die. The 1Gb LPDDR die is a high-speed CMOS, dynamic random-access memory containing 1,073,741,824 bits internally configured as a quad-bank DRAM. Each of the x32’s 268,435,456-bit banks is organized as 8192 rows by 1024 columns by 32 bits. ...
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Ball Assignments and Descriptions Figure 3: 152-Ball VFBGA Ball Assignments DM1 DQ13 DQ15 DDQ NC NC DQ6 DQ7 V DQ9 B DDQ C V DQS0 SSQ D DQ3 DQ5 DQ0 DQ1 ...
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Table 3: Ball Assignments Symbol Type A[13:0] Input Address inputs: Specify the row or column address. Also used to load the mode registers. The maximum address is determined by density and configuration. Consult the LPDDR product data sheet for the ...
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Electrical Specifications Stresses greater than those listed under “Absolute Maximum Ratings” may cause perma- nent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated ...
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Device Diagrams Figure 4: 152-Ball VFBGA Functional Block Diagram (non-Quad Die) RAS# CAS# WE# Address, BA0, BA1 PDF: 09005aef833913f1/Source: 09005aef833913d6 ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN 152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP) CS# CK CK# CKE LPDDR 8 Device ...
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Figure 5: 152-Ball VFBGA Functional Block Diagram, Quad Die CS0# CKE0 RAS# CAS# Address, BA0, BA1 CS1# CKE1 RAS# CAS# Address, BA0, BA1 PDF: 09005aef833913f1/Source: 09005aef833913d6 ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN 152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP) CK ...
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Package Dimensions Figure 6: 152-Ball VFBGA Package, 1.0mm (Package Code: CG) Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. ...
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Figure 7: 152-Ball VFBGA Package, 1.2mm (Package Code: KZ) Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0.35 SMD ball pads ...
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Revision History Rev. E, Production ...