MT46H64M32L2CG-6 IT:A TR Micron Technology Inc, MT46H64M32L2CG-6 IT:A TR Datasheet - Page 5

• Manufacturer Part Number: MT46H64M32L2CG-6 IT:A TR
• Description: IC DDR SDRAM 2GBIT 152VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT46H64M32L2CG-6 IT:A TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 2G (64M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 152-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ball Assignments and Descriptions
Figure 3:
PDF: 09005aef833913f1/Source: 09005aef833913d6
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN
AA
M
W
A
B
C
D
G
H
K
N
R
U
V
Y
E
F
L
P
T
J
DM0
DNU
V
DQ3
DQ0
V
DQ4
V
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
SSQ
SSQ
1
DD
1
DQS0
V
DQ5
DQ1
DQ2
NC
NC
V
V
V
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DDQ
2
2
SS
SS
SS
1
1
152-Ball VFBGA Ball Assignments
V
DQ6
NC
NC
DDQ
3
3
Notes:
DM1
DQ7
NC
NC
4
4
DQ13
V
1. Although not bonded to the die, these pins may be connected on the package substrate.
NC
NC
DDQ
5
5
DQ15
DQ9
NC
V
6
6
SS
1
DQ14
V
NC
V
SSQ
7
7
SS
1
DQS1
DQ10
NC
NC
8
8
DQ12
DQ11
NC
NC
9
9
Top View – Ball Down
DQ16
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
DQ8
NC
NC
10
10
DQ19
DQ17
V
V
11
11
5
DD
SS
DQ18
RFU
CK
TQ
12
12
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CKE1
CK#
V
V
13
13
SS
SS
Ball Assignments and Descriptions
V
DM2
V
V
14
DDQ
14
SSQ
DD
DQS2
V
CKE0
A13
15
DDQ
15
DQ21
V
V
A10
16
16
SSQ
DD
LPDDR
DQ20
DQ23
V
V
17
17
DD
SS
©2008 Micron Technology, Inc. All rights reserved.
DQ22
DM3
WE#
BA0
18
18
Supply
DQS3
DQ28
V
V
19
DDQ
19
SSQ
DQ24
DQ25
DQ27
V
CAS#
V
CS1#
V
BA1
V
V
NC
NC
NC
NC
A0
A2
A1
DDQ
A7
A8
A5
20
20
SSQ
SSQ
SS
SS
DQ26
DQ29
DQ31
V
DQ30
RAS#
V
CS0#
DNU
V
V
A11
V
A12
NC
NC
A3
A9
A6
A4
NC
21
DDQ
DDQ
21
Ground
SSQ
DD
DD
AA
M
W
A
B
C
D
G
H
K
N
R
U
V
Y
E
F
J
L
P
T