XCF128XFTG64C Xilinx Inc, XCF128XFTG64C Datasheet - Page 44

• Manufacturer Part Number: XCF128XFTG64C
• Description: IC PROM SRL 128M GATE 64-FTBGA
• Manufacturer: Xilinx Inc

Specifications of XCF128XFTG64C

• Memory Size: 128Mb
• Programmable Type: In System Programmable
• Voltage - Supply: 1.7 V ~ 2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TBGA
• Access Time: 85ns
• Supply Voltage Range: 1.7V To 2V
• Memory Case Style: FTBGA
• No. Of Pins: 64
• Operating Temperature Range: -40°C To +85°C
• Svhc: No SVHC (15-Dec-2010)
• Package /: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1578

Table 24: Quality and Reliability Characteristics
X-Ref Target - Figure 22
X-Ref Target - Figure 23
Notes:
1.
X-Ref Target - Figure 24
Notes:
1.
DS617 (v3.0.1) January 07, 2010
Product Specification
Notes:
1.
C
C
Program/erase cycles when V
Symbol
L
L
V
T
N
includes JIG capacitance.
includes JIG capacitance.
ESD
DR
PE
R
Data retention
Program/erase cycles (Endurance)
Electrostatic Discharge (ESD)
Figure 24: Connecting the READY_WAIT Pin when Using the Device
PP
0.1 µF
= V
V
0.1 µF
DDQ
0V
DDQ
V
DDQ
V
. See
Figure 22: AC Measurement I/O Waveform
Figure 23: AC Measurement Load Circuit
DDQ
Description
Table 21, page 44
V
DD
V
0.1 µF
DD
0.1 µF
Platform Flash XL High-Density Configuration and Storage Device
www.xilinx.com
Device
Under
Test
Device
for program/erase cycles when V
Under
Test
V
DDQ
V
22 kΩ
C
DDQ
L
(1)
4.7 kΩ
C
DS617_17_032708
READY_WAIT
L
DS617_19_101608
(1)
V
DS617_18_101608
DDQ
10,000
2
2,000
Min
22 kΩ
20
PP
(1)
= V
PPH
.
Max
–
–
–
Cycles
Units
Years
Volts
44