PCA9512AD,112 NXP Semiconductors, PCA9512AD,112 Datasheet - Page 19

• Manufacturer Part Number: PCA9512AD,112
• Description: IC LEVSHIFT I2C/SMBUS BUFF 8SOIC
• Manufacturer: NXP Semiconductors
• Type: I²C-Bus and SMBus Switchr

Specifications of PCA9512AD,112

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Applications: Hot-Swap/SMB Buffer
• Internal Switch(s): Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Logic Family: PCA
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3 / 3
• Logic Type: Bus Buffer
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3361-5; 935279721112; PCA9512AD

NXP Semiconductors
PCA9512A_PCA9512B
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 6.
Table 7.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
7
18.
Rev. 5 — 5 January 2011
Level shifting hot swappable I
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
PCA9512A; PCA9512B
Figure
350 to 2000
260
250
245
18) than a SnPb process, thus
2
C-bus and SMBus bus buffer
≥ 350
220
220
245
> 2000
260
245
© NXP B.V. 2011. All rights reserved.
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