VND810MSP STMicroelectronics, VND810MSP Datasheet
VND810MSP
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VND810MSP Summary of contents
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... Description The VND810MSP is a monolithic device designed in| STMicroelectronics VIPower M0-3 technology. The VND810MSP is intended for driving any type of multiple load with one side connected to ground. The Active V (a) device against low energy spikes (see ISO7637 transient compatibility table). Active current ...
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... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 17 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 VND810MSP = 13.5V ...
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... VND810MSP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CC Table 8. Switching (V = 13V 25° Table 9. Logic inputs Table 10. ...
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... Figure 29. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. PowerSO-10 tube shipment (no suffix Figure 34. PowerSO-10 tape and reel shipment (suffix “TR” 4/ CASE VND810MSP ...
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... VND810MSP 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE ...
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... Maximum switching energy E MAX (L = 400mH Power dissipation (per island tot T Junction operating temperature j T Case operating temperature c T Storage temperature stg 6/27 Parameter = 13.5V 150º bat jstart = 25°C lead VND810MSP Value Unit 0 200 mA Internally limited +/- 10 mA +/- 10 mA 4000 V 4000 V 5000 V 5000 V 225 ...
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... VND810MSP 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0.5cm to all V pins. Horizontal mounting and no artificial air flow When mounted on a standard single-sided FR-4 board with 6cm all V pins ...
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... IN OUT = 0V 3.5V IN OUT 0V OUT 125° 0V OUT CC T =25°C j Parameter Test conditions 5.5V < 0.5A 6mH OUT VND810MSP Min. Typ. Max. Unit 5 5.5 36 150 320 5V -75 = 13V; = 13V; Min. Typ. Max. 150 175 200 135 7 15 > TSD = 13V 0.6 0.9 1.2 < ...
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... VND810MSP Table Symbol V Forward on voltage F Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL I Low level input current IL V Input high level ...
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... Switching characteristics V OUT dV I SENSE INPUT 10/27 Parameter I < > V OUT OL OUT OL t DOL(on) 80% /dt OUT (on) 10 90% t DSENSE t d(on) VND810MSP Test conditions Min. Typ. Max OUT 1.5 2.5 IN OVER TEMP STATUS TIMING T > TSD V INn V STATn t SDL 90% dV /dt OUT (off) ...
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... VND810MSP Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device ...
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... INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS INPUT n LOAD CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD VND810MSP OV > V OUT OL ...
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... VND810MSP 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc= 36V Vin= Vout= 0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - (°C ) Figure 9. Input clamp voltage Vicl (V) 8 7.8 I in= 1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6 ...
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... Tc= 25ºC 150 100 Tc= - 40º Vcc (V) Vhyst (V) 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - 100 125 150 Tc (°C ) Vil (V) 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 -50 - 100 125 150 Tc (°C ) VND810MSP CC 40 175 175 ...
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... VND810MSP Figure 19. Status leakage current Ilstat (uA) 0.05 0.04 Vstat= 5V 0.03 0.02 0.01 0 -50 - (°C ) Figure 21. Status clamp voltage Vscl (V) 8 7.8 I stat= 1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C ) Figure 23. Open load off-state voltage detection threshold Vol (V) 5 4.5 ...
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... I maximum on-state currents of the different devices. 16/27 +5V +5V STATUS1 INPUT1 STATUS2 INPUT2 V GND GND ) S(on)max ) / ( - GND (when V < 0 during reverse battery situations) is: GND GND V CC OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor: becomes the sum of the S(on)max VND810MSP D ld ...
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... VND810MSP Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...
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... Olmin + R ))R < Olmin. PU out V batt DRI VER INP UT + LOGI TATUS ROUND ) connected between PU ) like the +5V line used to supply the has to be higher than OUT < OLmax L(off2) is pulled high (up to several mA), the pull L(off2) OUT R L VND810MSP OUT ...
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... VND810MSP 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance 0 single pulse repetitive pulse repetitive pulse Note: Values are generated with R In case of repetitive pulses, T must not exceed the temperature specified above for curves B and 100 L(mH) = 150ºC Jstart = 100º ...
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... Cu thickness = 35µm, Copper areas: from minimum pad lay-out to 8cm Figure 28. R thj-amb RTHj_amb (° 20/27 and Z measurements (PCB FR4 area = 58mm x 58mm, PCB PCB copper area in open box free air condition 2 4 PCB Cu heatsink area (cm^ 2) VND810MSP Tj-Tamb=50° ...
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... VND810MSP Figure 29. Thermal impedance junction ambient single pulse ZTH (°C/ W) 1000 100 10 1 0.1 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 0.01 0.1 Time ( – + THtp Pd2 Package and PCB thermal data ...
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... Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) VND810MSP Footprint 6 0.35 1.8 1.1 0 0.0001 7E-04 0.008 0.3 0. ...
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... VND810MSP 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 mechanical data Figure 31 ...
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... VND810MSP Max. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.35 1.40 14.40 14.35 1.80 1.10 8° ...
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... VND810MSP 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout 14.6 - 14 Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing ...
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... Cu condition insertion in thermal data table (page 3 output diode section update (page 4). CC Protections note insertion (page 4). Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. 3 Added contents, list of tables and figures. ® Added ECOPACK packages VND810MSP Changes information. ...
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... VND810MSP Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...