SE97BTP,547 NXP Semiconductors, SE97BTP,547 Datasheet - Page 3

• Manufacturer Part Number: SE97BTP,547
• Description: IC TEMP SENSOR DIMM 8HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE97BTP,547

• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Temperature Threshold: + 150 C
• Full Temp Accuracy: 2 C
• Digital Output - Bus Interface: I2C
• Digital Output - Number Of Bits: 11 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Description/function: Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-5055-2

NXP Semiconductors
3. Applications
4. Ordering information
Table 2.
[1]
SE97B_1
Product data sheet
Type number
SE97BTP
Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC WCE-3, PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
[1]
Ordering information
Topside
mark
97B
2.3 Serial EEPROM features
Programmable hysteresis threshold: off, 0 °C, 1.5 °C, 3 °C, 6 °C
Over/under/critical temperature EVENT output
B-grade accuracy:
Read and write voltage range: 3.0 V to 3.6 V
Operating current:
Organized as 1 block of 256 bytes (256 × 8)
100,000 write/erase cycles and 10 years of data retention
Permanent and Reversible Software Write Protect
Software Write Protection for the lower 128 bytes
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
HWSON8
±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
±1.0 °C/±2 °C (typ./max.) → +40 °C to +125 °C
±2.0 °C/±3 °C (typ./max.) → −40 °C to +125 °C
Write → 0.6 mA (typ.) for 3.5 ms (typ.)
Read → 100 μA (typ.)
Description
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
Rev. 01 — 27 January 2010
DDR memory module temp sensor with integrated SPD
© NXP B.V. 2010. All rights reserved.
SE97B
Version
SOT1069-2
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