C8051F060-TB Silicon Laboratories Inc, C8051F060-TB Datasheet - Page 5
![BOARD PROTOTYPING W/C8051F060](/photos/28/94/289414/tqfp-100_sml.jpg)
C8051F060-TB
Manufacturer Part Number
C8051F060-TB
Description
BOARD PROTOTYPING W/C8051F060
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Specifications of C8051F060-TB
Contents
Board
Processor To Be Evaluated
C8051F06x
Interface Type
USB
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
C8051F060
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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15. Oscillators ............................................................................................................. 171
16. Flash Memory ....................................................................................................... 177
17. External Data Memory Interface and On-Chip XRAM........................................ 187
18. Port Input/Output.................................................................................................. 203
15.1.Programmable Internal Oscillator ................................................................... 171
15.2.External Oscillator Drive Circuit...................................................................... 173
15.3.System Clock Selection.................................................................................. 173
15.4.External Crystal Example ............................................................................... 175
15.5.External RC Example ..................................................................................... 175
15.6.External Capacitor Example ........................................................................... 175
16.1.Programming The Flash Memory ................................................................... 177
16.2.Non-volatile Data Storage .............................................................................. 178
16.3.Security Options ............................................................................................. 179
17.1.Accessing XRAM............................................................................................ 187
17.2.Configuring the External Memory Interface .................................................... 188
17.3.Port Selection and Configuration.................................................................... 188
17.4.Multiplexed and Non-multiplexed Selection.................................................... 190
17.5.Memory Mode Selection................................................................................. 192
17.6.Timing .......................................................................................................... 194
18.1.Ports 0 through 3 and the Priority Crossbar Decoder..................................... 205
14.7.1.Enable/Reset WDT ................................................................................ 166
14.7.2.Disable WDT .......................................................................................... 166
14.7.3.Disable WDT Lockout ............................................................................ 166
14.7.4.Setting WDT Interval .............................................................................. 166
16.3.1.Summary of Flash Security Options....................................................... 183
17.1.1.16-Bit MOVX Example ........................................................................... 187
17.1.2.8-Bit MOVX Example ............................................................................. 187
17.4.1.Multiplexed Configuration....................................................................... 190
17.4.2.Non-multiplexed Configuration............................................................... 191
17.5.1.Internal XRAM Only ............................................................................... 192
17.5.2.Split Mode without Bank Select.............................................................. 192
17.5.3.Split Mode with Bank Select................................................................... 193
17.5.4.External Only.......................................................................................... 193
17.6.1.Non-multiplexed Mode ........................................................................... 196
17.6.2.Multiplexed Mode ................................................................................... 199
18.1.1.Crossbar Pin Assignment and Allocation ............................................... 205
18.1.2.Configuring the Output Modes of the Port Pins...................................... 206
18.1.3.Configuring Port Pins as Digital Inputs................................................... 207
18.1.4.Weak Pull-ups ........................................................................................ 207
17.6.1.1.16-bit MOVX: EMI0CF[4:2] = ‘101’, ‘110’, or ‘111’......................... 196
17.6.1.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘101’ or ‘111’..... 197
17.6.1.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘110’....................... 198
17.6.2.1.16-bit MOVX: EMI0CF[4:2] = ‘001’, ‘010’, or ‘011’......................... 199
17.6.2.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘001’ or ‘011’..... 200
17.6.2.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘010’....................... 201
Rev. 1.2
C8051F060/1/2/3/4/5/6/7
5
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