MPC8272ADS Freescale Semiconductor, MPC8272ADS Datasheet - Page 23

• Manufacturer Part Number: MPC8272ADS
• Description: KIT DEVELOPMENT MPC8272
• Manufacturer: Freescale Semiconductor
• Type: MPUr

Specifications of MPC8272ADS

• Contents: Board
• For Use With/related Products: MPC8272
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 2
Hardware Preparation and Installation
This chapter provides unpacking instructions and hardware preparation for the
MPC8272ADS.
2.1
If the shipping carton is damaged upon receipt, request that the carrier’s agent is present
during unpacking and inspection of equipment. Unpack the equipment from shipping
carton. and refer to the packing list to verify that all items are included. Save the packing
material for storing and reshipping the equipment.
2.2
To ensure that the desired configuration is selected to produce proper operation of the
MPC8272ADS board, changes of the dip-switch settings may be required before
installation. The location of the switches, indicators, dip-switches, and connectors is
illustrated in Figure 2-1. Boards are factory-tested and shipped with dip-switch settings as
described in the following tested graphs. Parameters can be changed for the following
conditions:
The PowerQUICC II internal logic supply level within range (V
RP1.
• PowerQUICC II’s MODCK(1:3). Determining core’s and CPM’s PLLs
• PowerQUICC II’s hard reset configuration word source - BCSR or memory
• PowerQUICC II’s boot code source EEPROM/FLASH using dip-switch SW2(1)
• PowerQUICC II’s MODCKH(0:3) using SW5(1-4)
• PowerQUICC II’s PCI_ARBITER using SW2(2)
multiplication factor using dip-switches SW5(#6 - #8)
(FLASH/EEPROM) using jumper JP9
Unpacking Instructions
Hardware Preparation
Avoid touching areas of integrated circuitry. Static discharge
can damage the circuits of this product.
Chapter 2. Hardware Preparation and Installation
NOTE
DDL
) using potentiometer