TLP3120(F) Toshiba, TLP3120(F) Datasheet - Page 9

• Manufacturer Part Number: TLP3120(F)
• Description: IC PHOTORELAY 80V 1.25A 6-SOP
• Manufacturer: Toshiba
• Series: TLP3120r

Specifications of TLP3120(F)

• Circuit: SPST-NO (1 Form A)
• Output Type: AC, DC
• On-state Resistance: 150 mOhm
• Load Current: 1.25A
• Voltage - Input: 1.15VDC
• Voltage - Load: 0 ~ 80 V
• Mounting Type: Surface Mount
• Termination Style: Gull Wing
• Package / Case: 6-SOP
• Input Type: DC
• Input Voltage (max): 1.3V
• Output Voltage (max): 80V
• Input Current (max): 50mA
• Output Current: 1.25A
• Circuit Arrangement: 1 Form A
• Package Type: SOP
• Output Device: MOSFET
• Pin Count: 6
• Mounting: Surface Mount
• Operating Temp Range: -20C to 85C
• Operating Temperature Classification: Commercial
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP3120F

Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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●
●
●
●
●
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●
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC