ESDAULC6-3BP6 STMicroelectronics, ESDAULC6-3BP6 Datasheet - Page 9

• Manufacturer Part Number: ESDAULC6-3BP6
• Description: IC ESD PROTECTION ARRAY SOT-666
• Manufacturer: STMicroelectronics
• Series: TRANSIL™r

Specifications of ESDAULC6-3BP6

• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6V
• Polarization: 3 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: SC-89-6, SOT-563F, SOT-666
• Polarity: Bidirectional
• Channels: 3 Channels
• Breakdown Voltage: 5.3 V
• Termination Style: SMD/SMT
• Capacitance: 1.5 pF
• Dimensions: 1.3 mm W x 1.7 mm L x 0.6 mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-7750-2; ESDAULC6-3BP6

ESDAULC6-3BP6, ESDAULC6-3BF2
Figure 25. Flip-Chip dimensions
Figure 28. Flip-Chip tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 26. Flip-Chip footprint
Solder mask opening recommendation:
All dimensions in mm
Solder stencil opening:
Copper pad Diameter:
220 µm recommended
330 µmrecommended
300 µmrecommended
0.71 +/- 0.05
500 µm ± 50
Dot identifying Pin A1 location
1.1 mm ± 50 µm
315 µm ± 50
Figure 27. Flip-Chip marking
User direction of unreeling
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4 +/- 0.1
(y = year
ww = week)
4 +/- 0.1
650 µm ± 65
Ø 1.5 +/- 0.1
Package information
x
y
w
x
w
E
z
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