PIC16F677-I/ML Microchip Technology, PIC16F677-I/ML Datasheet - Page 281

• Manufacturer Part Number: PIC16F677-I/ML
• Description: IC PIC MCU FLASH 2KX14 20QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F677-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 18
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PINDVA1004 - DEVICE ADAPTER 8/14/20DIP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
PIC16F631/677/685/687/689/690
N
Dimension Limits
A1
2
1
EXPOSED
A
E
Units
PAD
NOTE 1
A1
A3
E2
D2
D
N
A
E
K
e
b
L
E2
1
2
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.50 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.70
2.70
0.25
0.40
20
–
Microchip Technology Drawing C04-126B
D2
MAX
1.00
0.05
2.80
2.80
0.30
0.50
–
DS41262D-page 279
L
b
e
K