PIC24HJ64GP206-I/PT Microchip Technology, PIC24HJ64GP206-I/PT Datasheet - Page 238

• Manufacturer Part Number: PIC24HJ64GP206-I/PT
• Description: IC PIC MCU FLASH 32KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP206-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 18 Channel
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Height: 1 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06/X08/X10
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
TABLE 23-4:
DS70175F-page 236
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
DC18
Note 1:
DC5
PIC24HJXXXGPX06/X08/X10
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Param
No.
2:
3:
4:
Operating Junction Temperature Range
DC Characteristics
P
I/O = Σ ({V
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
V
Symbol
INT
DD
DR
POR
VDD
CORE
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
This is the limit to which V
These parameters are characterized but not tested in manufacturing.
V
Junction to ambient thermal resistance, Theta-
DD
= V
Core voltage must remain at V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
V
Internal regulator voltage
DD
x (I
DD
DD
DD
– V
V
DD
Start Voltage
Rise Rate
Core
(in Volts)
DD
3.0-3.6V
OH
Characteristic
– Σ I
Range
Characteristic
} x I
(3)
Rating
OH
OH
)
) + Σ (V
DD
(4)
can be lowered without losing RAM data.
OL
x I
SS
OL
(2)
for a minimum of 200 µs to ensure POR.
)
-40°C to +85°C
Temp Range
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
0.03
2.25
Min
3.0
1.1
—
JA
(
θ
Typ
JA
1.3
—
—
—
—
) numbers are achieved by package simulations.
(1)
Symbol
Symbol
P
DMAX
θ
θ
θ
P
Max
2.75
T
T
Vss
3.6
1.8
JA
JA
JA
—
A
D
J
-40°C ≤ T
Units
V/ms 0-3.0V in 0.1s
48.4
52.3
38.3
Min
Typ
-40
-40
V
V
V
V
PIC24HJXXXGPX06/X08/X10
(T
Voltage is dependent on load,
temperature and V
© 2007 Microchip Technology Inc.
P
A
J
INT
– T
≤ +85°C for Industrial
Max
Typ
Max MIPS
—
—
—
—
—
+ P
A
)/θ
40
I
Conditions
/
O
JA
°C/W
°C/W
°C/W
+125
Max
Unit
+85
DD
Notes
Unit
°C
°C
W
W
1
1
1