DSPIC33FJ128MC202-I/MM Microchip Technology, DSPIC33FJ128MC202-I/MM Datasheet - Page 22

• Manufacturer Part Number: DSPIC33FJ128MC202-I/MM
• Description: IC DSPIC MCU/DSP 128K 28-QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128MC202-I/MM

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 28-QFN
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
regulator output voltage. The V
connected to V
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to
“Electrical
information.
The placement of this capacitor should be close to the
V
exceed one-quarter inch (6 mm). Refer to
“On-Chip Voltage Regulator”
DS70291E-page 22
CAP
CAP
Ceramic
V
0.1 µF
DD
R
. It is recommended that the trace length not
C
pin, which is used to stabilize the voltage
R1
CPU Logic Filter Capacitor
Connection (V
TANK CAPACITORS
10 Ω
Tantalum
MCLR
V
V
10 µF
DD
SS
DD
Characteristics”
, and must have a capacitor between
RECOMMENDED
MINIMUM CONNECTION
dsPIC33F
Ceramic
0.1 µF
CAP
for details.
)
CAP
pin must not be
for
V
V
DD
Section 31.0
Section 28.2
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
additional
Ceramic
0.1 µF
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging.
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R ≤ 10 kΩ is recommended. A suggested
example,
2: R1 ≤ 470Ω will limit any current flowing into
Master Clear (MCLR) Pin
starting value is 10 kΩ. Ensure that the
MCLR pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
V
IH
DD
R
JP
C
and V
as
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
IH
specifications are met.
R1
© 2011 Microchip Technology Inc.
and V
IH
and V
IL
MCLR
in
specifications are met.
dsPIC33F
IL
Figure
Figure 2-2
) and fast signal
2-2,
within
it
is