DSPIC33FJ32GS610-I/PT Microchip Technology, DSPIC33FJ32GS610-I/PT Datasheet - Page 374

IC MCU/DSP 32KB FLASH 100TQFP

DSPIC33FJ32GS610-I/PT

Manufacturer Part Number
DSPIC33FJ32GS610-I/PT
Description
IC MCU/DSP 32KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ32GS610-I/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, QEI, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Core Frequency
40MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ32GS610-I/PT
Manufacturer:
Microchip
Quantity:
387
Part Number:
DSPIC33FJ32GS610-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
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DSPIC33FJ32GS610-I/PT
Manufacturer:
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Quantity:
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dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
FIGURE 27-12:
TABLE 27-31: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
DS70591C-page 374
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 27-1 for load conditions.
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SCK
2:
3:
4:
X
X
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
Symbol
SP36
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data
Input to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SP40
MSb In
MSb
Characteristic
SP11
SP41
SP30,SP31
SP35
SP10
(1)
Bit 14 - - - - - -1
Bit 14 - - - -1
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
Min
CY
CY
30
23
30
/2
/2
Typ
SP21
SP20
6
LSb In
(2)
LSb
Max
SP20
SP21
20
-40°C  T
-40°C  T
Units
 2010 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
 +85°C for Industrial
 +125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 4
See parameter D031
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
Conditions

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