PIC16LF877-04/L Microchip Technology, PIC16LF877-04/L Datasheet - Page 159

• Manufacturer Part Number: PIC16LF877-04/L
• Description: IC MCU FLASH 8KX14 EE A/D 44PLCC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF877-04/L

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-PLCC
• Controller Family/series: PIC16LF
• No. Of I/o's: 33
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

15.3
PIC16F873/874/876/877-04
PIC16F873/874/876/877-20
D001
D001A
D001A
D002
D003
D004
D005
Note 1: This is the limit to which V
Param
2001 Microchip Technology Inc.
(Extended)
No.
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from
6: The
7: When BOR is enabled, the device will operate correctly until the V
DC Characteristics:
Data is “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only, and are not tested.
loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption.
The test conditions for all I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
estimated by the formula Ir = V
characterization and is for design guidance only. This is not tested.
added to the base I
Symbol
V
S
V
V
V
POR
BOR
VDD
DD
DR
current is the additional current consumed when this peripheral is enabled. This current should be
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
MCLR = V
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset
Voltage
DD
DD
Start Voltage to
Rise Rate to ensure
Characteristic/
(1)
DD
Device
DD
or I
; WDT enabled/disabled as specified.
DD
PD
DD
PIC16F873/874/876/877-04 (Extended)
PIC16F873/874/876/877-10 (Extended)
measurement.
can be lowered without losing RAM data.
measurements in active operation mode are:
DD
/2R
EXT
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
0.05
Min
4.0
4.5
3.7
BOR
—
—
(mA) with R
EXT
Typ†
V
1.5
4.0
is not included. The current through the resistor can be
—
—
SS
EXT
Max
4.35
5.5
5.5
5.5
—
—
—
in kOhm.
Units
V/ms See section on Power-on Reset for
-40°C
V
V
V
V
V
V
BOR
LP, XT, RC osc configuration
HS osc configuration
BOR enabled, F
See section on Power-on Reset for
details
details
BODEN bit in configuration word
enabled
voltage trip point is reached.
T
A
+125°C
PIC16F87X
Conditions
MAX
DS30292C-page 157
DD
= 10 MHz
DD
;
and V
SS
(7)
.