PIC16LF877-04/L Microchip Technology, PIC16LF877-04/L Datasheet - Page 160

IC MCU FLASH 8KX14 EE A/D 44PLCC

PIC16LF877-04/L

Manufacturer Part Number
PIC16LF877-04/L
Description
IC MCU FLASH 8KX14 EE A/D 44PLCC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheet

Specifications of PIC16LF877-04/L

Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
44-PLCC
Controller Family/series
PIC16LF
No. Of I/o's
33
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
4MHz
No. Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LF877-04/L
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F87X
15.3
DS30292C-page 158
PIC16F873/874/876/877-04
PIC16F873/874/876/877-20
D020A
D021B
D023
Note 1: This is the limit to which V
Param
(Extended)
D010
D013
D015
No.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from
6: The
7: When BOR is enabled, the device will operate correctly until the V
DC Characteristics:
Data is “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only, and are not tested.
loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption.
The test conditions for all I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
estimated by the formula Ir = V
characterization and is for design guidance only. This is not tested.
added to the base I
Symbol
I
I
I
I
DD
BOR
PD
BOR
current is the additional current consumed when this peripheral is enabled. This current should be
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
MCLR = V
Supply Current
Brown-out
Reset Current
Power-down Current
Brown-out
Reset Current
Characteristic/
DD
Device
DD
or I
; WDT enabled/disabled as specified.
PD
DD
(6)
(6)
DD
(2,5)
PIC16F873/874/876/877-04 (Extended)
PIC16F873/874/876/877-10 (Extended) (Continued)
measurement.
can be lowered without losing RAM data.
measurements in active operation mode are:
DD
(3,5)
/2R
EXT
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
(mA) with R
EXT
Typ†
10.5
is not included. The current through the resistor can be
1.6
1.5
85
85
7
EXT
Max
200
200
15
60
30
4
in kOhm.
Units
mA
mA
-40°C
A
A
A
A
BOR
RC osc configurations
F
HS osc configuration,
F
BOR enabled, V
V
V
BOR enabled, V
voltage trip point is reached.
OSC
OSC
DD
DD
T
A
= 4.0V, WDT enabled
= 4.0V, WDT disabled
= 4 MHz, V
= 10 MHz, V
+125°C
2001 Microchip Technology Inc.
Conditions
DD
DD
DD
DD
DD
= 5.0V
= 5.0V
= 5.5V
DD
= 5.5V
;
and V
SS
.

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