LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 3

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC1311_13_42_43
Product data sheet
Type number
LPC1311FHN33 HVQFN33
LPC1313FBD48 LQFP48
LPC1313FHN33 HVQFN33
LPC1342FHN33 HVQFN33
LPC1343FBD48 LQFP48
LPC1343FHN33 HVQFN33
Type number
LPC1311FHN33
LPC1313FBD48
LPC1313FHN33
LPC1342FHN33
LPC1343FBD48
LPC1343FHN33
Ordering information
Ordering options for LPC1311/13/42/43
4.1 Ordering options
Package
Name
Flash
8 kB
32 kB
32 kB
16 kB
32 kB
32 kB
Description
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 × 7 × 0.85 mm
Total
SRAM
4 kB
8 kB
8 kB
4 kB
8 kB
8 kB
All information provided in this document is subject to legal disclaimers.
USB
-
-
-
Device
Device
Device
Rev. 3 — 10 August 2010
UART
RS-485
1
1
1
1
1
1
I
Fast+
1
1
1
1
1
1
2
C/
32-bit ARM Cortex-M3 microcontroller
SSP
1
1
1
1
1
1
LPC1311/13/42/43
ADC
channels
8
8
8
8
8
8
Pins
33
48
33
33
48
33
© NXP B.V. 2010. All rights reserved.
Package
HVQFN33
LQFP48
HVQFN33
HVQFN33
LQFP48
HVQFN33
Version
n/a
n/a
n/a
n/a
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