LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 58

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
14. Revision history
Table 22.
LPC1311_13_42_43
Product data sheet
Document ID
LPC1311_13_42_43 v.3
Modifications:
LPC1311_13_42_43 v.2
LPC1311_13_42_43 v.1
Revision history
Release date
20100810
20100506
20091211
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•
•
•
•
•
•
•
V
Reset state of pins and start logic functionality added in
Section 7.18.1
Table “Power consumption in Deep-sleep mode for individual analog blocks” removed.
Deep-sleep mode functionality changed to allow BOD and watchdog oscillator as the
only analog blocks allowed to remain running in Deep-sleep mode
V
T
Size of GPIO registers updated in
Editorial updates.
Template updated.
cy(CLK)
ESD
DD
range changed to 3.0 ≤ V
All information provided in this document is subject to legal disclaimers.
limit changed to −6500 V (min) /+6500 V (max) in
conditions updated in
Rev. 3 — 10 August 2010
Data sheet status
Product data sheet
Product data sheet
Product data sheet
added.
DD
Table
≤ 3.6 V in
Figure
17.
Change notice Supersedes
-
-
-
6.
32-bit ARM Cortex-M3 microcontroller
Table
LPC1311/13/42/43
15.
Table
LPC1311_13_42_43 v.2
LPC1311_13_42_43 v.1
-
Table 3
6.
to
Table
© NXP B.V. 2010. All rights reserved.
(Section
4.
7.17.5.2).
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