LPC2131FBD64/01,15 NXP Semiconductors, LPC2131FBD64/01,15 Datasheet - Page 2

• Manufacturer Part Number: LPC2131FBD64/01,15
• Description: IC ARM7 MCU FLASH 32K 64-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2131FBD64/01,15

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 64-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 47
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 47
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 60MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 47
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Package: 64LQFP
• Family Name: LPC2000
• Maximum Speed: 60 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4005; 935281771151; LPC2131FBD64/01-S

NXP Semiconductors
3. Ordering information
LPC2131_32_34_36_38
Product data sheet
Table 1.
Type number
LPC2131FBD64
LPC2131FBD64/01 LQFP64
LPC2132FBD64
LPC2132FBD64/01 LQFP64
LPC2132FHN64
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
LPC2134FBD64
LPC2134FBD64/01 LQFP64
One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of
up to 16 analog inputs, with conversion times as low as 2.44 μs per channel.
Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-time clock with independent power and dedicated 32 kHz clock input.
Multiple serial interfaces including two UARTs (16C550), two Fast I
SPI and SSP with buffering and variable data length capabilities.
Vectored interrupt controller with configurable priorities and vector addresses.
Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN
package.
Up to nine edge or level sensitive external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 μs.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O
pads.
Ordering information
All information provided in this document is subject to legal disclaimers.
Package
Name
LQFP64
LQFP64
HVQFN64 plastic thermal enhanced very thin quad flat
LQFP64
Rev. 5 — 2 February 2011
Description
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
2
C-bus (400 kbit/s),
© NXP B.V. 2011. All rights reserved.
Version
SOT314-2
SOT314-2
SOT314-2
SOT314-2
SOT804-2
SOT804-2
SOT314-2
SOT314-2
2 of 45