LPC2131FBD64/01,15 NXP Semiconductors, LPC2131FBD64/01,15 Datasheet - Page 40

• Manufacturer Part Number: LPC2131FBD64/01,15
• Description: IC ARM7 MCU FLASH 32K 64-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2131FBD64/01,15

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 64-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 47
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 47
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 60MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 47
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Package: 64LQFP
• Family Name: LPC2000
• Maximum Speed: 60 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4005; 935281771151; LPC2131FBD64/01-S

NXP Semiconductors
Fig 17. Package outline SOT804-2 (HVQFN64)
LPC2131_32_34_36_38
Product data sheet
HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals;
body 9 x 9 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT804-2
max.
terminal 1
index area
terminal 1
index area
A
1
L
E h
0.05
0.00
A
1
16
e
1
17
0.80
0.65
64
A
4
- - -
IEC
0.30
0.18
b
1/2
0.2
e
c
D 1
D h
e 1
D
9.05
8.95
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
0
8.95
8.55
D
REFERENCES
1
Rev. 5 — 2 February 2011
b
7.25
6.95
D
h
49
32
9.05
8.95
E
JEITA
33
48
- - -
1/2
E 1 E
B
e
8.95
8.55
w
E
e
v
scale
1
A
M
M
5
e 2
C
C
7.25
6.95
E
h
A
B
LPC2131/32/34/36/38
0.5
e
A
Single-chip 16/32-bit microcontrollers
7.5
e
A 4
1
A 1
y 1 C
10 mm
7.5
e
2
PROJECTION
EUROPEAN
0.5
0.3
detail X
L
0.1
v
X
C
y
0.05
© NXP B.V. 2011. All rights reserved.
w
ISSUE DATE
04-03-25
0.05
c
y
SOT804-2
0.1
y
1
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