LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 59

• Manufacturer Part Number: LPC1769FBD100,551
• Description: IC ARM CORTEX MCU 512K 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1769FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: Ethernet, USB, OTG, CAN
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4966; 935290522551

NXP Semiconductors
LPC1769_68_67_66_65_64_4
Product data sheet
Fig 27. LPC1769/68/66/65/64 USB device port configuration
14.2 XTAL1 input
14.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
LPC17xx
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
capacitor to ground C
mode, a minimum of 200 mV (RMS) is needed. For more details see the LPC17xx User
manual.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Fig 28. Slave mode operation of the on-chip oscillator
i
= 100 pF. To limit the input voltage to the specified range, choose an additional
USB_UP_LED
USB_CONNECT
USB_D+
USB_D−
V
BUS
33 Ω
33 Ω
g
Rev. 04 — 1 February 2010
V
which attenuates the input voltage by a factor C
DD
V
DD
XTAL1
LPC1769/68/67/66/65/64
LPC1xxx
C i
100 pF
x1
and C
002aae835
32-bit ARM Cortex-M3 microcontroller
C g
x2
should be chosen smaller
V
SS
V
BUS
D+
D−
x1
, C
x2
, and C
USB-B
connector
002aad943
i
/(C
© NXP B.V. 2010. All rights reserved.
i
+ C
x3
g
). In slave
in case of
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