ST72F324BJ6B6 STMicroelectronics, ST72F324BJ6B6 Datasheet - Page 156

• Manufacturer Part Number: ST72F324BJ6B6
• Description: MCU 8BIT 32KB FLASH/ROM 42-SDIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F324BJ6B6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Controller Family/series: ST7
• No. Of I/o's: 32
• Ram Memory Size: 1KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• No. Of Pwm Channels: 3
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• For Use With: 497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5589-5

Electrical characteristics
Table 102. EMS test results
12.8.2
Table 103. EMI emissions
1. Refer to application note AN1709 for data on other package types.
2. Not tested in production.
156/193
Symbol Parameter
Symbol
S
V
V
EMI
FESD
FFTB
Peak level
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
Electromagnetic interference (EMI)
Based on a simple application running on the product (toggling two LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
(2)
V
T
conforming to
SAE J 1752/3
A
Conditions
DD
= +25 °C
Parameter
= 5 V
8/16 Kbyte Flash
LQFP32 and LQFP44
32 Kbyte Flash
LQFP32 and LQFP44
8/16 Kbyte ROM
LQFP32 and LQFP44
32 Kbyte ROM
LQFP32 and LQFP44
DD
Device/package
and V
DD
32 Kbyte Flash or ROM device:
V
conforms to IEC 1000-4-2
8 or 16 Kbyte ROM device:
V
conforms to IEC 1000-4-2
8 or 16 Kbyte Flash device:
V
conforms to IEC 1000-4-2
V
conforms to IEC 1000-4-4
(1)
DD
DD
DD
DD
= 5 V, T
= 5 V, T
= 5 V, T
= 5 V, T
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
frequency band
Monitored
A
A
A
A
= +25 °C, f
= +25°C, f
= +25 °C, f
= +25 °C, f
Conditions
OSC
OSC
OSC
OSC
= 8 MHz
8/4 MHz
= 8 MHz
= 8 MHz
Max vs [f
= 8 MHz
3.0
3.0
3.0
12
19
15
13
20
16
12
23
15
17
24
18
3
OSC
16/8 MHz
/f
ST72324Bxx
3.5
3.5
3.5
3.5
Level/class
18
25
22
14
25
21
15
26
20
21
30
23
CPU
]
3B
4A
4B
4A
dBµV
dBµV
dBµV
dBµV
Unit
-
-
-
-