C8051F819-GM Silicon Laboratories Inc, C8051F819-GM Datasheet - Page 37

• Manufacturer Part Number: C8051F819-GM
• Description: IC MCU 8BIT 8KB FLASH 20QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F81xr

Specifications of C8051F819-GM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-QFN
• Processor Series: C8051F8x
• Core: 8051
• Data Bus Width: 16 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F800DK
• Minimum Operating Temperature: - 55 C
• Package: 20QFN EP
• Device Core: 8051
• Family Name: C8051F8xx
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1799-5

6. SOIC-16 Package Specifications
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
A1
A2
E1
D
A
b
E
e
c
Components.
1.25
0.10
0.31
0.17
Min
—
Table 6.1. SOIC-16 Package Dimensions
Figure 6.1. SOIC-16 Package Drawing
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
Nom
Max
1.75
0.25
0.51
0.25
—
Rev. 1.0
Dimension
aaa
bbb
ddd
ccc
L2
h
L

0.40
0.25
Min
C8051F80x-83x
0º
0.25 BSC
Nom
0.10
0.20
0.10
0.25
0.50
Max
1.27
8º
37